[Published Papers] | [ESCML Technical Reports]
[CALCE Articles]

Published Papers*

E.B. Magrab, S.K. Gupta, F.P. McClusky, and P.A. Sandborn, Integrated Product and Process Design and Development - The Product Realization Process, 2nd Edition, CRC Press, Boca Raton, FL, 2010.

P. Sandborn, “System-Level DMSMS Management,” Proceedings DMSMS Conference, Orlando, FL, September 2009.

K. Feldman, T. Jazouli, and P. Sandborn, “A Methodology for Determining the Return on Investment Associated with Prognostics and Health Management,” IEEE Trans. on Reliability, Vol. 58, No. 2, pp. 305-316, June 2009.

P. Sandborn, J. Myers, T. Barron, and M. McCarthy , "Using Teardown Analysis as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling," International Journal of Engineering Education, Vol. 25, No. 1, pp. 42-52, 2009.

P. Sandborn and J. Myers, "Designing Engineering Systems for Sustainment," Handbook of Performability Engineering, ed. K.B. Misra, Springer, pp. 81-103, London, 2008.

P. Sandborn and K. Feldman, “The Economics of Prognostics and Health Management,” Prognostics and Health Management of Electronics, ed. M. G. Pecht, pp. 85-118, John Wiley & Sons, Inc., Hoboken, NJ, 2008.

K. Feldman, P. Sandborn and T. Jazouli, “The Analysis of Return on Investment for PHM Applied to Electronic Systems,” Proceedings of the International Conference on Prognostics and Health Management, Denver, CO, October 2008.

P. Sandborn and R. Nelson III, “Constraint-Driven Refresh Planning of Systems Subject to Obsolescence,” Proceedings DMSMS Conference, Palm Springs, CA, September 2008.

P. Sandborn and V. Prabhakar, “An Electronic Part Total Ownership Cost Model,” Proceedings DMSMS Conference, Palm Springs, CA, September 2008.

P. Sandborn and O. Ahmad, “Advanced Part Obsolescence Forecasting as an Enabler for Strategic Management of DMSMS Problems,” Proceedings DMSMS Conference, Palm Springs, CA, September 2008.

P. Sandborn, V. Prabhakar, and B. Eriksson "The Application of Product Platform Design to the Reuse of Electronic Components Subject to Long-Term Supply Chain Disruptions," Proceedings of the ASME 2008 International Design Engineering Conferences & Computers and Information in Engineering Conference, New York, NY, Aug. 2008.

P. Sandborn, “Strategic Management of DMSMS in Systems,” DSP Journal, pp. 24-30, April/June 2008.

A. Kleyner and P. Sandborn, "Minimizing Life Cycle Cost by Managing Product Dependability via Validation Plan and Warranty Return Cost," International Journal of Production Economics, Vol. 112, No. 2, pp. 796-807, April 2008.

P. Sandborn, "Trapped on Technology’s Trailing Edge,” IEEE Spectrum, Vol. 45, No. 4, pp. 42-45, 54, 56-58, April 2008.

P. Sandborn and P. A. Sandborn, “A Random Trimming Approach for Obtaining High-Precision Embedded Resistors,” IEEE Trans. on Advanced Packaging, Vol. 31, No. 1, pp. 76-81, February 2008.

P. Sandborn, "Software Obsolescence - Complicating the Part and Technology Obsolescence Management Problem," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 886-888, December 2007.

P.A. Sandborn and C. Wilkinson, "A Maintenance Planning and Business Case Development Model for the Application of Prognostics and Health Management (PHM) to Electronic Systems," Microelectronics Reliability, Vol. 47, No. 12, pp. 1889-1901, December 2007.

E. Scanff, K.L. Feldman, S. Ghelam, P. Sandborn, M. Glade, and B. Foucher, "Life Cycle Cost Estimation of Using Prognostic Health Management (PHM) for Helicopter Avionics," Microelectronics Reliability, Vol. 47, No. 12, pp. 1857-1864, December 2007.

P. Sandborn and M. Pecht, "Guest Editorial: Introduction to Special Section on Electronic Systems Prognostics and Health Management," Microelectronics Reliability, Vol. 47, No. 12, pp. 1847-1848, December 2007.

P. Sandborn, V. Prabhakar, and D. Feng, "DMSMS Lifetime Buy Characterization Via Data Mining of Historical Buys," Proceedings DMSMS Conference, Orlando, FL, November 2007.

P. A. M. Sandborn and P. A. Sandborn, “Using Embedded Resistor Emulation to Teach Measurement Methods and Associated Engineering Model Development,” International Journal of Engineering Education, Vol. 23, No. 4, pp. 834-840, 2007.

B. Etienne and P. Sandborn, "Optimizing Embedded Passive Content in Printed Circuit Boards," IEEE Trans. on Electronics Packaging Manufacturing, Vol. 30, No. 4, pp. 246-257, October 2007.

P. Sandborn, F. Mauro, and R. Knox, "A Data Mining Based Approach to Electronic Part Obsolescence Forecasting," IEEE Trans. on Components and Packaging Technologies, Vol. 30, No. 3, pp. 397-401, September 2007.

K. Feldman and P. Sandborn, "Integrating Technology Obsolescence Considerations into Product Design Planning," Proceedings of the ASME 2007 International Design Engineering Conferences & Computers and Information in Engineering Conference, Las Vegas, NV, Sept. 2007.

P. Sandborn, "Designing for Technology Obsolescence Management," Proceedings of the 2007 Industrial Engineering Research Conference, Nashville, TN, May 2007.

J. Myers and P. Sandborn, "Integration of Technology Roadmapping Information and Business Case Development into DMSMS-Driven Design Refresh Planning of the V-22 Advanced Mission Computer," Proceedings of the 2007 Aging Aircraft Conference, Palm Springs, CA, April 2007.

D. Feng, P. Singh, and P. Sandborn, "Optimizing Lifetime Buys to Minimize Lifecycle Cost," Proceedings of the 2007 Aging Aircraft Conference, Palm Springs, CA, April 2007.

P. Sandborn and R. Jafreen, "Cost of Accommodating the Transition to Lead-Free Electronics," Proceedings of the 2007 Aging Aircraft Conference, Palm Springs, CA, April 2007.

P. Sandborn, R. Jung, R. Wong, and J. Becker, "A Taxonomy and Evaluation Criteria for DMSMS Tools, Databases and Services," Proceedings of the 2007 Aging Aircraft Conference, Palm Springs, CA, April 2007.

D.P. Fitzgerald, J.W. Herrmann, P.A. Sandborn, L.C. Schmidt, and T.H. Gogoll, "Design for Environment (DfE): Strategies, Practices, Guidelines, Methods, and Tools," in Environmentally Conscious Mechanical Design, M. Kutz editor, pp. 1-24, 2007.

A. Kleyner and P. Sandborn, "Forecasting the Cost of Unreliability for Products with Two-Dimensional Warranties," Proceedings of the European Safety and Reliability Conference (ESREL), Estoril, Portugal, pp. 1903-1908, Sept 18-22, 2006.

P. Sandborn and G. Plunkett, "The Other Half of the DMSMS Problem - Software Obsolescence," DMSMS Knowledge Sharing Portal Newsletter, Vol. 4, Issue 4, pp. 3 and 11, June 2006.

P. Singh and P. Sandborn, "Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems," The Engineering Economist, Vol. 51, No. 2, pp. 115-139, April-June 2006.

P. Sandborn, J. Myers, T. Barron, and M. McCarthy , "Using Reverse Engineering as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling," Proceedings of the International Electronics Packaging Education Conference (at the Electronic Components and Technology Conference), May 30, 2006.

Z. Shi and P. Sandborn, "Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly," Journal of Electronic Testing Theory and Applications (JETTA), Vol. 22, pp. 49-60, 2006

D.P. Fitzgerald, J.W. Herrmann, P.A. Sandborn, L.C. Schmidt, and T.H. Gogoll, "Beyond Tools: A Design for Environment Process," International Journal of Performability Engineering, Vol. 1, No. 2, pp. 105-120, October 2005.

A. Kleyner and P. Sandborn, “A Warranty Forecasting Model Based on Piecewise Statistical Distributions and Stochastic Simulation,” Reliability Engineering and System Safety, Vol. 88, No. 3, pp 207-214, June 2005.

P. Sandborn, “An Assessment of Embedded Resistor Trimming and Rework,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 28, No. 2, pp. 176-186, April 2005.

P. Sandborn, F. Mauro, and R. Knox, "A Data Mining Based Approach to Electronic Part Obsolescence Forecasting," Proc. DMSMS Conference, Nashville, TN, April 2005.

P. Singh and P. Sandborn, “Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems,” Proc. Reliability and Maintainability Symposium (RAMS), Arlington, VA, Jan. 2005.

P. Sandborn, “A Decision Support Model for Determining the Applicability of Prognostics Health Management (PHM) Approaches to Electronic Systems,” Proc. Reliability and Maintainability Symposium (RAMS), Arlington, VA, Jan. 2005.  --  note, this paper has been superseded by the following paper: link

P. Sandborn, "Beyond Reactive Thinking – We Should be Developing Pro-Active Approaches to Obsolescence Management Too!," DMSMS Center of Excellence Newsletter, Vol. 2, Issue 3, pp. 4 and 9, July 2004.

P. Sandborn and P. Singh, "Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronics Systems," Logistics Spectrum, Vol. 38, No. 2, pp. 25-28, April-June 2004.

P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, "Electronic Part Obsolescence Driven Design Refresh Planning," International Journal of Agile Manufacturing, Vol. 7, No. 1, pp. 23-32, 2004.

A. Kleyner, P. Sandborn, and J. Boyle, " Minimization of Life Cycle Costs Through Optimization of the Validation Program – A Test Sample Size and Warranty Cost Approach," Proc. Reliability and Maintainability Symposium, Los Angeles, CA, Jan. 2004.

P. Sandborn, T. Herald, J. Houston, and P. Singh, "Optimum Technology Insertion into Systems Based on the Assessment of Viability," IEEE Trans. on Components and Packaging Technologies, Vol. 26, No. 4, pp. 734-738, December 2003. 

M. Wood, D. Fritz, D. Sawoska, Frank Durso, L. Salzano, and P. Sandborn, "Performance of Plated Additive Resistors," Proc. Taiwan Printed Circuit Association Meeting, October 2003.

Z. Shi and P. Sandborn, "Optimization of Test/Diagnosis/Rework Location and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms," Proc. International Test Conference, October 2003.

P. Sandborn, B. Etienne, J. W. Herrmann, and M. M. Chincholkar, "Cost and Production Analysis for Substrates with Embedded Passives," Circuit World, Vol. 30, No. 1, pp. 25-30, 2003.

Z. Shi and P. Sandborn, "Modeling Test, Diagnosis, and Rework Operations and Optimzing Their Location in General Manufacturing Processes," Proceedings ASME 8th Design for Manufacturing Conference, Chicago, IL, September 2003.

P. Sandborn, "A Review of the Economics of Embedded Passives," in Proceedings of InterPACK, July 2003.

P. Sandborn, "The Economics of Embedded Passives," in Integrated Passive Component Technology, R. Ulrich and L. Schaper editors, Wiley-IEEE Press, 2003.

J. P. Dougherty, J. Galvagni, L. Marcanti, R.  Sheffield, P. Sandborn, and R. Ulrich, "The NEMI Roadmap: Integrated Passives Technology and Economics," Keynote Paper, Proceedings of the Capacitor and Resistor Technology Symposium (CARTS), Scottsdale, AZ, April 2003.

P. Singh, P. Sandborn, D. Lorenson, and T. Geiser, "Determining Optimum Redesign Plans for Avionics Considering Electronic Part Obsolescence Forecasts," in Proc. World Aviation Congress, Phoenix, AZ, November 2002.  (SAE Technical Paper: 2002-1-3012)

D. Humphrey, W. Shawlee, P. Sandborn, and D. Lorenson, "Aging Aircraft Usable Life and Wear-out Issues," in Proc. World Aviation Congress, Phoenix, AZ, November 2002.  (SAE Technical Paper: 2002-1-3013)

P. Sandborn and P. Singh, "Electronic Part Obsolescence Driven Design Refresh Optimization," in Proc. FAA/DoD/NASA Aging Aircraft Conference, San Francisco, CA, September 2002.

P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, "Electronic Part Obsolescence Driven Design Refresh Optimization," Proc. International Conference on Concurrent Engineering, pp. 961-970, Cranfield University, UK, July 2002.

D. Ragan, P. Sandborn, and P. Stoaks, “A Detailed Cost Model for Concurrent Use With Hardware/Software Co-Design,” IEEE Design Automation Conference, New Orleans, LA, pp. 269-274, June 2002.

M. Pecht, R. Solomon, P. Sandborn, C. Wilkinson, and D. Das, Life Cycle Forecasting, Mitigation Assessment and Obsolescence Strategies, CALCE EPSC Press, 2002.

T. Trichy, P. Sandborn, R. Raghavan, and S. Sahasrabudhe, “A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly,” in Proceedings of the International Test Conference, pp. 1108-1117, November 2001.

P. Sandborn, B. Etienne and D. Becker, "Analysis of the Cost of Embedded Passives in Printed Circuit Boards," in Proceedings of the IPC Annual Meeting, Orlando, FL, October 2001.

P. A. Sandborn, B. Etienne, and G. Subramanian, “Application-Specific Economic Analysis of Integral Passives,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 203-213, July 2001.

D. Becker and P. Sandborn, “On the Use of Yielded Cost in Modeling Electronic Assembly Processes,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 195-202, July 2001.

D. Becker and P. Sandborn, “Using Yielded Cost as a Metric for Modeling Manufacturing Processes,” ASME 6th Design for Manufacturing Conference, Pittsburgh PA, September 2001.

J. Dougherty, J. Galvagni, L. Marcanti, P. Sandborn, R. Charbonneau, and R.  Sheffield, "The NEMI Roadmap Perspective on Integrated Passives," Proceedings of the European Microelectronics and Packaging Conference & Exhibition, May 2001.

P. Sandborn and C. F. Murphy, "Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis," in Proc. of the Electronic Components and Technology Conference, May 2001, pp. 1261-1266.

B. Etienne and P. A. Sandborn, “Application-Specific Economic Analysis of Integral Passives,” in Proceedings of the IMAPS Advanced Packaging Materials Processes, Properties and Interfaces Symposium, Braselton GA, March 2001, pp. 399-404.

R. Solomon, P. Sandborn and M. Pecht, “Electronic Part Life Cycle Concepts and Obsolescence Forecasting,” IEEE Trans. on Components and Packaging Technologies, December 2000, pp. 707-713.

P. Sandborn, D. T. Allen, and C. F. Murphy, "New Course Development in Products and Systems Cost Analysis," in Proc. of the Electronic Components and Technology Conference, May 2000, pp. 1021-1026.

P. Sandborn and P. Spletter, "A Comparison of Routing Estimation Methods for Microelectronic Modules," Microelectronics International, December 1999, pp. 36-41.

P. A. Sandborn and C. F. Murphy, "A Model for Optimizing the Assembly and Disassembly of Electronic Systems," IEEE Trans. on Electronics Packaging Manufacturing, vol. 22, no. 2, April 1999, pp. 105-117.

M. Lindell, P. Stoaks, D. Carey, and P. A. Sandborn, "The Role of Physical Implementation in Virtual Prototyping of Electronic Systems," IEEE Trans. on Components, Packaging, and Manufacturing Technology – Part A, December 1998, pp. 610-616.

P. A. Sandborn and M. Vertal, "Packaging Tradeoff Analysis: Predicting Cost and Performance During System Design," IEEE Design & Test of Computers, vol. 15, no. 3, July-September 1998, pp. 10-19.

P. A. Sandborn and C. F. Murphy, "Material-Centric Modeling of PWB Fabrication: An Economic and Environmental Comparison of Conventional and Photovia Board Fabrication Processes," IEEE Trans. on Components, Packaging, and Manufacturing Technology – Part C, vol. 21, April 1998, pp. 97-110.

P. E. Stoaks and P. A. Sandborn, "Modeling the Impact of Packaging During High-Level System Design: The Integration of Physical Partitioning into Virtual Prototyping," in Proc. of the High-Level Electronic Design Conference, San Jose, CA, pp. 197-204, Oct. 1997.

C. A. Palesko and P. A. Sandborn, "System-Level Impact of Early Packaging Decisions," in Proc. of INTERpack, June 1997.

C. F. Murphy, M. Abadir, and P. Sandborn, "Economic Analysis of Test and Known Good Die or Multichip Assemblies," Journal of Electronic Testing (JETTA), pp. 151-166, 1997.

*This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by the copyright holder. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 

 

ESCML Technical Reports (contact Peter Sandborn for access to these reports)
ESCML 00-1 T. Trichy, Full Monte Carlo Technical Cost Modeling with Detailed Test/Rework Analysis for Use in a Multi-Attribute Optimization Environment, June 2000.
ESCML 00-2 G. Subramanian, Analysis Methods for Performing Size/Cost Tradeoff Analysis for the Use of Embedded Passives in Printed Wiring Boards, July 2000.
ESCML 00-3 R. Sabrahmanyam, The Economic Impact of Component Replacement in Electronic Systems, July 2000.
ESCML 00-4 J. Radhakrishnan, A Process-Based Cost of Ownership Model for the Inclusion of High-Frequency Micromachined Structures on a Conventional IC, September 2000.
ESCML 01-1 S. Sahasrabudhe, Implementation and Interpretation of Failure Free Operating Periods and Associated Confidence Limits in Electronic Systems Using the 3-Parameter Weibull Distribution, May 2001.
ESCML 01-2 D. Ragan, Detailed Cost Modeling for use with Hardware/Software Co-Design of a System on a Chip, July 2001.
ESCML 01-3 R. Raghavan, Analysis of Test/Diagnosis/Rework Operation Placement in the Technical Cost Modeling of Advanced Electrical Power System Modules, July 2001.
ESCML 01-4 P. Singh, Part Obsolescence Driven Design Refresh Optimization for Electronic Systems, December 2001.
ESCML 02-1 MOCA User's Guide, Version 1.2, April 2002.
ESCML 02-2 D. Becker, Development and Application of Yielded Cost in Electronic Manufacturing Process Improvement, May 2002.
ESCML 02-3 MOCA Design Refresh Analysis of a Northrop Grumman F-22 Radar Unit, November 2003.
ESCML 02-4 D. Calhan, An Application of the 3-Parameter Weibull Distribution to the Estimation of the Failure Free Operating Period of Electronic Systems, December 2002.
ESCML 03-1 MOCA User's Guide, Version 1.3
ESCML 03-2 Electronic Part Obsolescence Forecasting Methodology for PartMiner, September 2003.
ESCML 03-3 L. Salzano, Experimental Reliability Assessment and Failure Analysis for Reworked and Trimmed Embedded Resistor Technologies, September 2003.
ESCML 03-4 P. Sandborn, A Decision Support Model That Explores the Applicability of Prognostic Health Management (PHM) to Electronic Systems as a Function of the Degree to Which Failures in Electronic Systems are Deterministic in Nature and the Confidence Level Associated with PHM Forecasts, June 2003.
ESCML 03-5 Z. Shi, Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly, July 2003.
ESCML 03-6 P. Singh, Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Obsolescence Sensitive Sustainment-Dominated Systems, December 2003.
ESCML 03-7 B. Etienne, Cost and Size Analysis and Optimization of Embedded Passives in Printed Circuit Boards, December 2003.
ESCML 04-1 MOCA Design Refresh Analysis of a Lockheed Martin MTADS Video Processor Card, January 2004.
ESCML 04-2 A. Goswami, Design Refresh Planning for System Software Changes Precipitated by Hardware Obsolescence, 2004.
ESCML 04-3 Schlumberger Part Selection and Management Benchmarking Report, July 2004.
ESCML 04-4 Q-Star/MOCA Interface - Supplement to MOCA User's Guide, V. 1.3, August 2004.
ESCML 04-5 P. Singh, Demonstration Integration of Design Refresh Costing and Design Refresh Planning - LPD-17 NDU Case Study, November 2004.
ESCML 05-1 B. Etienne, The Development of Cost and Size Analysis for the Assessment of Embedded Passives in Printed Circuit Boards, March 2005.
ESCML 05-2 MOCA User's Guide, Version 2.1, July 2005.
ESCML 05-3 A. Kleyner, Determining Optimal Reliability Targets Through Analysis of Product Validation Cost and Field Warranty Data, November 2005.
ESCML 05-4 MOCA User's Guide, Version 2.2 Supplement, December 2005.
ESCML 06-1 LOTE User's Guide, Version 1, February 2006.
ESCML 06-2 MOCA (Mitigation of Obsolescence Cost Analysis) DGNS Case Study, June 2006.
ESCML 07-1 LOTE User's Guide, Version 2, January 2007.
ESCML 07-2 D. Feng, Optimizing Lifetime Buy Quantities to Minimize Lifecycle Cost, May 2007.
ESCML 07-3 J. Myers, Integration of Technology Roadmapping Information into DMSMS-Driven Design Refresh Planning of the V-22 Advanced Mission Computer, May 2007.
ESCML 07-4 MOCA User's Guide, Version 2.3 Supplement, June 2007.
ESCML 08-1 Prognostics and Health Management Return on Investment Tool User's Guide, Version 2.0, February 2008.
ESCML 08-2 K. Feldman, Electronic Prognostics and Health Management: A Return on Investment Analysis, April 2008.
ESCML 08-3 R. Jafreen, A Cost Model for Assessing the Transition to Lead-Free Electronics, April 2008.
ESCML 08-4 Prognostics and Health Management Return on Investment Tool User's Guide, Version 2.1, September 2008.
ESCML 09-1 Prognostics and Health Management Return on Investment Tool User's Guide, Version 2.2, February 2009.
ESCML 09-2 Prognostics and Health Management Return on Investment Tool User's Guide, Version 2.3, April 2009.
ESCML 09-3 MOCA User's Guide, Version 2.4, October 2009.
ESCML 09-4 A. Chaloupka, Lead-Free Electronics Use and Dynamic Repair Process Simulation, December 2009.

Last updated: October 21, 2009