ENME Webcast Fall 2006

Leaders in Mechanical Engineering Lecture Series

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Title: Photomechanics Methods as Applied to Microelectronics Product Development
Professor Bongtae Han
University of Maryland, College Park, Department of Mechanical Engineering

Original Air Date: Friday, September 22nd, at 2:00pm

Abstract: As the components and structures involved in high-end electronic packages are made smaller, the thermal gradient increases and the strain concentrations become more serious. Numerical analyses have been used extensively to estimate stresses and strains in packaging structures. Although one can model almost any kind of electronic packaging product for complex loading and boundary conditions, the models and results usually require verification by other means. Accordingly, advanced experimental techniques are in high demand to provide accurate solutions for deformation studies of electronic packages. In the past decades, numerous optical methods for deformation measurements have been matured and emerged as important engineering tools. The methods provide whole-field displacement information with various sensitivities and resolutions. More recently, several methods have been applied to electronic packaging product development. The unique capabilities provided by the methods made them ideally suited for the broad range of problems encountered in electronic packaging product development. The seminar presents recent developments of the optical methods as a tool for electronic packaging product development and illustrates selected applications in design evaluation, failure analysis, and verification of numerical modeling.