Articles in Refereed Journals.

Bhavnani, S.H, Bar-Cohen, A., and Joshi, Y., 2000, “The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics, “ Journal of Engineering Education, pp 423-427

Momoki, S., A. Bar-Cohen, and A.E. Bergles,” 2000, Estimation of Major Correlations for Frictional Pressure Drop in Gas-Liquid Two-Phase Flow in Horizontal Pipes Using Predicted Flow Regime Information,” Multiphase Science and Technology, Vol 12, Nos. 3&4, pp 161-175

Prstic, S., Iyengar, M. and Bar-Cohen, A., 2001, “Bypass Effect in High Performance Heat Sinks”, Transactions of the Journal of Mechanical Engineering, Special Issue, Vol. 47, pp. 441-448, ISSN 0039-2480

Iyengar, M.and Bar-Cohen, A., 2001, “Design for Manufacturability of SISE Parallel Plate Forced Convection Heat Sinks,“ Transactions of IEEE-Component and Packaging Technologies, Vol 24,, No. 2, pp 150-158

Cardozo, R., Durfee, W., Ardichvili, A., Adams, C., Erdman, A., Hoey, M., Iaizzo, P., Mallick, D., Bar-Cohen, A., Beachy, R., Johnson, A., 2002, “Experiential Education In New Product Design and Business Development, accepted for publication, Journal of Product Innovation Management, Vol 19, pp 4-17           

Yazawa, K., Solbrekken, G., and Bar-Cohen, A., 2002, “Modeling and Analysis of Heat Driven Forced Convection Cooling”, Thermal Science & Engineering Vol. 10, No. 5, pp 29-36, Heat Transfer Society of Japan

Bar-Cohen, A., Iyengar, M., and Benjaafar, S.,2002, “Design for Manufacturability of Natural Convection Cooled Heat Sinks,” International Journal of Transport Phenomena, Vol 4, pp 43-57

Bar-Cohen, A. and Iyengar, M., 2002, "Design and Optimization of Air-cooled Heat Sinks for Sustainable Development," IEEE CPT Transactions, Vol 25, Number 4, pp 584-591

Arik, M. and Bar-Cohen, A., 2003, “Effusivity-Based Correlation of Surface Property Effects in Pool Boiling CHF of Dielectric Liquids,” International Journal of Heat and Mass Transfer, Vol 46, pp 3755-3764

Afgan, N., Carvalho, M. Prstic, S., Bar-Cohen, A., 2003, “Sustainability Assessment of Aluminum Heat Sink Design,” Heat Transfer Engineering, 24 (4), pp 39-48

Iyengar, M., and Bar-Cohen, A., 2003, “Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development,” IEEE CPT Transactions, Volume 26, Number1, pp 16-25

Iyengar, M., and Bar-Cohen, A., 2003, “Least-Energy Optimization of Forced Convection Plate-Fin Heat Sinks,” IEEE CPT Transactions, Volume 26, Number 1, pp 62-70

Narasimhan, S., Bar-Cohen, A., Nair, R., 2003, “Thermal Compact Modeling of Parallel Plate Heat Sinks”, Vol 26, Number 1, IEEE CPT Transactions, pp 136-146

Narsimhan, S., Bar-Cohen, A., Nair, R., 2003, “Flow and Pressure Field Characteristics in the Porous Block Compact Modeling of Parallel Plate Heat Sinks”, IEEE CPT Transactions, Vol. 26, No 1, pp147-157.

Bar-Cohen, A. , Iyengar, M, and Kraus, A.D., 2003, “Design of Optimum Plate Fin Natural Convection Heat Sinks,” ASME Transactions – Journal of Electronic Packaging, Vol. 125, Number 2, pp 208-216

Arik, M., Garg, J., Bar-Cohen, A., 2004, “Thermal Modeling and Performance of High Flux SOP Packages,” IEEE Transactions on Advanced Packaging, Vol 27, No. 2, May 2004, pp 398-412

Krueger, W. and Bar-Cohen, A., 2004, “Optimal Numerical Design of Forced Convection Heatsinks,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No 2, pp 417-425

Yazawa, K,. Solbrekken, G.L., and Bar-Cohen, A,, 2005, “Thermoelectric-Powered Convective Cooling of Microprocessors,” IEEE Transactions on Advanced Packaging, Vol. 28, No. 2, pp 231-239

Zhang, Y. Shakouri, A., Bar-Cohen, A,. 2005 “Superlattice MIcrorefrigerators Flip-Chip Bonded with Optoelectronic Devices, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, pp 658-666

Bahadur, R., Bar-Cohen, A., 2005, “Thermal Design and Optimization of Polymer-Based Pin Fin Natural Convection Heat Sinks,” IEEE Transactions on Components and Packaging Technologies, Volume 28, Issue 2, June 2005 pp 238-246

Arik, M., Zurn, S., Bar-Cohen, A., Polla, D., 2005, “Design and Fabrication of MEMS Micropumps for High Flux Electronics Cooling Applications,” Smart Materials and Structures, Vol 14 (2005), pp 1239-1249

Bar-Cohen, A., Bahadur, R., and lyengar, M., 2006, “Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainability-Theory, Geometry and Material Selection,” Energy, Vol. 31, pp 579-619

Wang, P., Bar-Cohen, A., Yang, B., Solbrekken, G., Shakouri, A., 2006, "Analytical Modeling of Silicon Thermoelectric Microcooler" Journal of Applied Physics, Vol. 100, Issue 1, Published online July 6, 2006    

Prstic, S. and Bar-Cohen, A., 2006, “Shield-Enhanced Performance of an Unshrouded, Forced Convection Heat Sink, “ASME Journal of Electronic Packaging, Vol. 128, No. 2, pp 172-176

Bar-Cohen, A., Arik, M., Ohadi, M., 2006, “Direct Liquid Cooling of High Flux Micro and Nano Electronic Components,” IEEE Proceedings, August 2006, Vol 94, No. 8, pp1549-1570
26. Bahadur, R. and A. Bar-Cohen, 2006, "Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer," International Journal of Heat and Mass Transfer, Published On-Line, December 2006

ACCEPTED FOR PUBLICATION:

Arik, M., Bar-Cohen, A., You, S.M., 2006, “Enhancement of Pool Boiling Critical Heat Flux in Dielectric Liquids by Microporous Coatings,” accepted for publication, International Journal of Heat and Mass Transfer, July 2006

Yang, B., Wang, P., Bar-Cohen, A., 2006, “Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices,” accepted for publication in the IEEE Transactions on Components and Packaging Technologies, April 2006 .

Kim, KJ, Bar-Cohen, A., Han, B.T., 2007, ”Thermo-Optical Modeling of Intrinsically Heated Polymer Fiber Bragg Grating, “ accepted for publication, Applied Optics, January 2007

Kim, K.J., Bar-Cohen, A., and Han, B.T, 2007, “Thermo-Optical Modeling of Polymer Fiber Bragg Grating Illuminated by Light Emitting Diode,” accepted for publication, IJHMT, March 2007

Wang, P., Bar-Cohen, A., 2007, "On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers," accepted for publication, Journal of Applied Physics,  May 2007

Book Reviews, Other Articles, and Notes.

Eckert, E.R.G., Goldstein, R.J., Ibele, W., S.V., Simon, T.W., T.H. Keuhn, Strykowski, P.J., Tamma, K.K., T.H., Bar-Cohen, A., Heberlein, J.V.R.., Davidson, Bischof, J., Kulacki, F, Kortshagen, U., "Heat Transfer - A Review of the 1996 Literature," IJHMT, Vol 43, pp 1273-1371, 2000

Eckert, E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 1997Literature," IJHMT, Vol 43, pp 2431-2528, 2000

Bar-Cohen, Avram, “Thermal Packaging At The Millennial Divide,” Electronic Cooling Magazine, Vol 6, No 1, pp32-40, 2000

Eckert, E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, A., Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 1998 Literature," IJHMT, Vol 44, pp 253-366, 2001

Eckert, E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, A., Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 1999 Literature," IJHMT, Vol 44, 2001, pp??

Eckert, E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, A., Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 2000 Literature," IJHMT, Vol 45, 2002, pp??

Eckert, E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, A., Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 2002 Literature," IJHMT, Vol 47, 2003, pp Eckert,

E.R.G., Goldstein, R.J., Ibele, W., Patankar, S.V., Simon, T.W., Kuehn, T.H., Strykowski, P.J., Tamma, K.K, Bar-Cohen, A., Heberlein, J.V.R., Davidson, J.H., Bischof, J., Kulacki, F.A., Kortshagen, U., and Garrick, S., "Heat Transfer - A Review of the 2003 Literature," IJHMT, Vol 48, 2004, pp

S. V. Garimella, Y. K. Joshi, A. Bar-Cohen, R. Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B. Sammakia, and F. Andros, “Thermal Challenges in Next Generation Electronic Systems - Summary of Panel Presentations and Discussions,” IEEE Transactions on Components and Packaging Technologies, Vol 25, Number 4, 2003, pp 569-576

Invited talks, etc.     

Bar-Cohen, Avram, “Thermal Packaging Theory and Trends,” Thermacore World Wide Engineering Conference, Invited Lecture, Millersville, Pennsylvania, January 2000

Bar-Cohen, Avram, “Thermal Science and Engineering: Future Challenges and Opportunities” Conference Plenary Lecture, Israel Conference on Mechanical Engineering, Beer Sheva, Israel, June, 2000

Bar-Cohen, Avram, Prstic, S., Iyengar, M., Yazawa,K. ,“Design and Optimization of Forced Convection Heat Sinks for Sustainable Development,” Conference Keynote Lecture, International Conference on Renewable Technologies for Sustainable Development, Madeira, Portugal, June 2000

Bar-Cohen, Avram, “Professional MS programs in Engineering:  Minnesota Experience, ” Academic Forum, INCOSE Annual Conference, Minneapolis, Minnesota, July, 2000

Bar-Cohen, Avram, “High Heat Flux Cooling Solutions,” Intel Power Wall Forum, Invited Lecture, Portland, Oregon, August, 2000

Bar-Cohen, Avram, “Thermal Packaging – History, Technology, and Trends,” Keynote, Sony Technology Week, Tokyo, Japan, December 2000

Bar-Cohen, Avram, “Advanced Cooling for a kW-Level Computer, NCR Corporation, San Jose, California, May 2001.

Bar-Cohen, Avram, “Cooling Electronics: Challenges and Opportunities”, Cooling Zone-Thermal Summit, Keynote Lecture, Marlboro, MA, August 2001.

Bar-Cohen, Avram, “Design and Optimization Air-Cooled Heat Sinks for Sustainable Development, Keynote Lecture, UEF THERMES Conference, Santa Fe, NM, January, 2002.

Bar-Cohen, A., “Thermal Management of High Power Electronics, “ IEEE Distinguished Lecture, Hong Kong University of Science and Technology, March, 2002

Bar-Cohen, Avram, “Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development”, Keynote Address, IEEE ITHERM Conference, San Diego, CA, June, 2002.

Bar-Cohen, Avram, “Impact of Nanotechnology on the Future Practice of Engineering”, Conference Plenary Lecture, CHISA Conference, Prague, Czech Republic, August 2002

Bar-Cohen, Avram, “Thermal Management of Electronics – Technology Trends and Opportunities for HVAC/Refrigeration Industry,” ASHRAE Winter Meeting, January 25-29, 2003, Chicago, Illinois

Bar-Cohen, Avram, “Least Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development,” Spring 2003 Colloquium Series, Mechanical and Aerospace Engineering department, Rutgers University, New Brunswick, NJ, February 2003

Bar-Cohen, A., Watwe, A., and Arik, M. “Pool Boiling Critical Heat Flux in Dielectric Liquids”, Keynote Lecture, 5th International Conference on Boiling Heat Transfer, Montego Bay, Jamaica, May 2003.

Bar-Cohen, A., “Trends and Challenges in Thermal Management of Electronics,” Invited Lecture, ASME-ATI 1st Workshop, Rome, Italy, June 2003

Bar-Cohen, A. “Liquid Cooling of High Flux Electronics: Status, Opportunities, and Challenges,” Keynote Lecture, Third International Business and Technology Summit for Thermal Management of Electronics, Framingham, Mass, August 2003

Bar-Cohen, Avram, “Advances in Thermal Management of Electronic Components and Systems,” Invited Lecture, 5th MSNC Technology Symposium,” Sony Corp, Tokyo, Japan, January 2004 

Bar-Cohen, Avram, “Advances in Thermal Management of Electronic Components and Systems,” Mechanical Engineering Department Seminar, Hanyang University, Seoul, Korea , January 2004

Bar-Cohen, Avram, “Advances in Thermal Management of Electronic Components and Systems,” MEMS Laboratory Seminar, Samsung Advanced Institute of Technology, Kihueng, Korea, January 2004

Kim, D.W., Kim, K.J., Han, B.T., Bar-Cohen, A., 2004, “Effect of Residual Stresses on Plastic Encapsulated Fiber Brag Gratings,” IEEE-CPMT First International Workshop on Nano-Bio Packaging, Ga Tech, Atlanta, March 22-23, 2004

Kim, K.J., Bar-Cohen, A., Han, B.T., 2004, “Thermally-Induced Bragg Wavelength Shifts in Polymer,” IEEE-CPMT First International Workshop on Nano-Bio Packaging, Ga Tech, Atlanta, March 22-23, 2004

Bar-Cohen, A. , Bahadur, R., Iyengar, M., “Least-Energy Optimization of Air-Cooled Heat Sinks – Theory, Geometry, and Material Selection,” Keynote Lecture,  ASME-ZSIS International Thermal Science Seminar – ITSS, Bled, Slovenia, June 2004

Bar-Cohen, A, 2004, "Challenges and Opportunities in the Thermal Management of Nanoelectronics" Invited Lecture, Southwest Mechanics Lecture Series, University of Oklahoma, Norman, OK, October 7th, 2004

Bar-Cohen, A, 2004, "Challenges and Opportunities in the Thermal Management of Nanoelectronics" Invited Lecture, Southwest Mechanics Lecture Series, Oklahoma State University, Stillwater, OK, October 8th, 2004

Bar-Cohen, A., 2005, “Least-Energy Optimization of Air-Cooled Heat Sinks – Theory, Geometry, and Material Selection,” Mechanical Engineering Seminar, Johns Hopkins University, Baltimore, Maryland, February 3rd, 2005

Bar-Cohen, A, 2005, "Challenges and Opportunities in the Thermal Management of Nanoelectronics" Invited Lecture, Southwest Mechanics Lecture Series, University of Texas – Arlington, Arlington, Texas, February 18th, 2005

Bar-Cohen, A., Bergles, A.E., Pribyl, D., 2005, “Relating Critical Heat Flux to the Two-Phase Flow Regimes in Upward Steam and Water Flow.” Invited Lecture, XV Seminar – School, Problems of Gas Dynamics, Heat and Mass Transfer in Power Plants,” Kaluga, Russia, May 23-27, 2005

Bar-Cohen, A, 2005, “Challenges and Opportunities in Thermal Engineering
at the Micro and Nano Scales,” Plenary Lecture, Israel 30th ME Conference, Tel Aviv, Israel, May 29-30, 2005

Bar-Cohen, A., 2006, “Challenges and Opportunities in the Thermal Management of Nanoelectronics,” Invited Colloquium, MANE Department, RPI, Troy, NY, March 2006

Bar-Cohen, A., 2006, “Thermal Packaging – the Moving Frontier,” Conference Keynote, IEEE SemiTherm Conference, Dallas, TX, March 2006

Bar-Cohen, A., 2006, “Thermal Packaging Frontier – Challenges and Opportunities,” Invited Lecture, IBM Cooling Council, Poughkeepsie, NY, May 2, 2006

Bar-Cohen, A., 2006, “Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales,” Conference Keynote Lecture, IEEE IMPACT 2006, Taipei, Taiwan, October 18-20, 2006

Bar-Cohen, A., 2006, “Thermal Packaging of Microsystems,” Invited Seminar, National Tsing Hua University, Mechanical Engineering Department, Hsinchu, Taiwan, October 20, 2006

Bar-Cohen, A., 2007, ‘Semiconductor Thermal Packaging – The Moving Frontier,” IEEE Distinguished Lecture, Richmond, Va, March 1, 2007

Bar-Cohen, A., Rahim, E., 2007, “Modeling and Prediction of Two-Phase Microgap Channel Heat Transfer Characteristics, “ Keynote Lecture, International Conference on Nanochannels, Microchannels and Minichannels, Peubla, Mexico, June 2007

Bar-Cohen, A., Wang, P., Bachmann, C., 2007, “Thermal Analysis and Control of On-Chip Hotspots, “ Plenary Lecture, International Symposium on Transport Phenomena, ISTP-18, August, 2007, Daejon, Korea ,

Referenced Conference Proceedings

Geisler, K. and Bar-Cohen, A., 2000, "Design and Analysis of an Optimum Boiling Heat Sink," UEF Boiling 2000: Phenomena and Emerging Applications, Anchorage, Alaska, May, 2000

Momoki, S., Bar-Cohen, A., and Bergles, A.E., 2000, "Estimation of Major Correlations for Frictional Pressure Drop in Gas-Liquid Two-Phase Flow in Horizontal Pipes Using Predicted Flow Regime Information," UEF Boiling 2000:Phenomena and Emerging Applications, Anchorage, Alaska, May

Iyengar, M., Bar-Cohen, A., 2000, “Design for Manufacturability of SISE Parallel Plate Forced Convection Heat Sinks, “ Proceedings, IEEE ITHERM’00, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 2000, Las Vegas, Nevada, USA,

Dvinsky, A., Bar-Cohen, A., Srelets, M, 2000, Thermofluid Analysis of Staggered and In Line Pin Fin Heat Sinks,” Proceedings, IEEE ITHERM’00, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 2000, Las Vegas, Nevada, USA,

Prstic, S., Iyengar, M, Bar-Cohen, A., 2000, “By Pass Effect in High Performance Heat Sinks,” Proceedings of the ASME –ZSITS International Thermal Science Seminar, Bled, Solvenia, June 11-14, 2000, pp 255-262

M., Yigit, S., Arik Bar-Cohen, A., You, S.M., 2000, “Correlating Surface Property Effects on, Pool Boiling CHF,” ASME National Heat Transfer Conference, August, Pittsburgh, Pa  

Arik, M, Zurn, S.M., Yigit, K, and Bar-Cohen, A., 2000,  “Design, Fabrication, and Experimental-Numerical Study of PZT sensors,” Proceedings, International Conference on Modeling and Simulation of Microsystems, MSM 00, San Diego

Arik, M. and A. Bar-Cohen, “Ebullient Cooling of Integrated Circuits by Novec Fluids”, 2001, Paper IPACK2001-15515, Proceedings of IPACK ’01, July 8-13, 2001, Kauai, HA.

Solbrekken, G. L., K. Yazawa, K.C. Coxe, and A. Bar-Cohen, 2001, “Passive Cooling Limits for Unventilated Notebook Computers”, Paper IPACK2001-15785, Proceedings of IPACK ’01, July 8-13, Kauai, HA.

Coxe, W.K., Solbrekken, G.L., Yazawa, K., Bar-Cohen, A., 2002, “Experimental Modeling of the Passive Cooling Limit of Notebook Computers”, Proceedings of the ITHERM Conference, May 2002, San Diego, CA

Iyengar, M. and Bar-Cohen, A., 2002, “Least-Energy Optimization of Forced Convection Plate-Fin Heat Sinks”, Proceedings of the ITHERM Conference, May 2002, San Diego, CA.

Solbrekken, G., Coxe, W., Yazawa, K., Bar-Cohen, A., 2002, “Passive Cooling Limits for Ventilated Notebook Computers”, Proceedings of the 12th International Heat Transfer Conference, Grenoble, France, August 2002

Garg, J., Arik, M., Bar-Cohen, A., Wolf, R., Vukasonovic, B., Hartley, J.G., Glazer, A., “2002, Synthetic Jet Enhancement of Natural Convection and Pool Boiling in a Dielectric Liquid”, Proceedings of the 12th International Heat Transfer Conference, Grenoble, France, August 2002

Iyengar, M., Bar-Cohen, A., 2002, “Least-Energy Optimization of Air Cooled Heat Sinks”, Proceedings of the 12th International Heat Transfer Conference, Grenoble, France, August 2002.

Geisler, K., Bar-Cohen, A., 2003, “Nucleate Pool Boiling Heat Transfer in Narrow Vertical Channels,” 5th International Boiling Conference, Montego Bay, Jamaica, May 2003

Pribyl, D., Bar-Cohen, A., Bergles, A.E., 2003, “An Investigation of Critical Heat Flux and Two-Phase Flow Regimes for Upward Steam and Water Flow,” 5th International Boiling Conference, Montego Bay, Jamaica, May 2003

Bar-Cohen, A., Watwe, A., and Arik, M. 2003, “Pool Boiling Critical Heat Flux in Dielectric Liquids”, 5th International Conference on Boiling Heat Transfer, Montego Bay, Jamaica, May 2003

Geisler, K. and Bar-Cohen, A., M. 2003, “Nucleate Pool Boiling Heat Transfer in Narrow Vertical Channels”, 5th International Conference on Boiling Heat Transfer, Montego Bay, Jamaica, May 2003.

Narasimhan, S. and Bar-Cohen, A., 2003, “Compact Modeling Of Unshrouded Plate Fin Heat Sinks,” Proceedings of IPACK’03, Maui, Hawaii, July

Solbrekken, G., Yazawa. K., and Bar-Cohen, A., 2003, “Chip Level               Refrigeration of Portable Electronic Equipment using Thermoelectric Devices,” Proceedings of IPACK’03, Maui, Hawaii, July

Yazawa. K., Solbrekken, G., and Bar-Cohen, A., 2003, “Thermofluid Design Of Energy Efficient And Compact Heat Sinks ” Proceedings of IPACK’03, Maui, Hawaii, July

Kim, KJ and Bar-Cohen, A, 2003, “Thermo-Optical Behavior Of Passively-   Cooled Polymer Waveguides,” Proceedings, ASME IMECE Conference,        Washington DC, November 

Ohadi, M. and Bar-Cohen, A., 2003, “Emerging Technologies for Spot Cooling of High Heat Flux Electronics.” Proceedings, ASME IMECE Conference,            Washington DC, November 

Cibuzar, G., Fischer, M., Williamson, F., Blumenfeld, M., Suntharalingam, J.R. Grenz, B.G. Van Ness, K. Kim, K. Bar-Cohen, A. Eccleston, E., 2003, “Development of a new technique for DNA single base pair mismatch analysis”, Proceedings of 15th Biennial/University/Government/ Industry Microelectronics Symposium, Boise, ID, June 30-July 2, 2003, p 184-194

Kim, KJ, Bar-Cohen, A., Han, BT, 2004, “Thermo-Optical Characteristics Of Bragg Grating Polymer Waveguides,” 1st International Symposium On Micro & Nano Technology, 14-17 March, 2004, Honolulu, Hawaii, USA

Yazawa1, K, G. L. Solbrekken and A. Bar-Cohen, 2004, “Stabilized Thermal   Resistance Model for Thermo Electric Power Generation for Thermal Management,” 1st International Symposium On Micro & Nano Technology, 14-17 March, 2004, Honolulu, Hawaii, USA

Shakouri, A., Zhang, Y., Piprick, J., Bar-Cohen, A., 2004, "Superlattice           Microrefrigerators Flip-Chip Bonded with Optoelectronic Devices", Proceedings, IEEE Semi-Therm Conference, San Jose, Ca, March 2004  

Bar-Cohen, A., Bahadur, R., Iyengar, M., 2004, “Least energy optimization of air cooled heat sinks for sustainability-theory, geometry and material selection,” Proceedings of The ASME – ZSIS International Thermal Science Seminar II Bled, Slovenia (ITSS 2004), June 13 – 16, 2004, pp. 33-51.

Prstic, S. and Bar-Cohen, A., 2004, “Shield-Enhanced Performance of an Unshrouded, Forced Convection Heat Sink, “ Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004

Bahadur, R. and Bar-Cohen, A., 2004, “Thermal Design and Optimization of Polymer Based Pin Fin Natural Convection Heat Sinks,” Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004, Vol 1 pp 268-279

Solbrekken, G., Yazawa. K., and Bar-Cohen, A., 2004, “Thermal Management  of Portable Electronic Equipment Using Thermoelectric Energy Conversion,” Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004

Solbrekken, G., Yazawa. K., and Bar-Cohen, A., 2004, “ Experimental Demonstration of Thermal Management Using Thermoelectric Energy Conversion,” Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004

Geisler, K. Straznicky, I., Bar-Cohen. A., 2004, “Immersion Cooling Module for Military COTS Applications,” Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004

Solbrekken, G., Zhang, Y., Bar-Cohen, A., Shakouri, A., 2004, “Use of Superlattice Thermionic Emission for “Hot Spot” Reduction in a Convectively- Cooled Chip,” Proceedings, IEEE ITHERM 2004, Las Vegas, NV June 2004

Bahadur, R., Bar-Cohen, A., 2005, “Thermal Performance Limits of Air-Cooled Polymer Composite Heat Sinks,” Proceedings, IEEE 55th ECTC 2005, May 2005, Florida, USA, pp 1720-1727

Zhang, Y.,  Zeng, G., Bar-Cohen, A., Shakouri, A., 2005,” Is ZT the Main Performance Factor for Spot Cooling Using 3D Microrefrigeratiors?,”  IMPAS Thermal Management Workshop (Student Award Paper)  

Zhang, Y., Shakouri, A. , Bar-Cohen, A., Wang, P., Yang, B., “Experimental Demonstration of Microrefrigerator Flip-Chip Bonded with IC chips for Hot-spots Thermal Management”, Proceeding of InterPack’05, July 17th -22nd, 2005, San Francisco, California

Bar-Cohen, A., Wang, P., Yang, B., Solbrekken, G., Zhang, Y., Shakouri, A., 2005, “Silicon Thermoelectric Micro-Cooler for Hot-Spot Thermal Management,” Proceedings, InterPack’05, July 2005, San Francisco, Ca

Geisler, K. And Bar-Cohen, A., 2005, “Surface Effects on Confinement-Driven Pool Boiling Enhancement in Vertical Parallel-Plate Channels,” Paper Number HT2005-72666, Proceedings of HT2005, July 2005, San Francisco, USA

Bahadur, R., Bar-Cohen, A., 2005, “Orthotropic Thermal Conductivity Effect on Cylindrical Pin Fin Heat Transfer, “Proceedings, InterPack’05, July 2005, San Francisco, Ca, USA, IPACK2005-73181

Nabi, A., Rodgers, P., Bar-Cohen, A., 2006, "Prediction of Thermal Performance Degradation of Air-Cooled Fine-Pitch Fin Array Heat Sinks Due to Fouling," Proceedings, IEEE 2006 SemiTherm Conference, Dallas, Tx

Bahadur, R., and Bar-Cohen, A. 2006, “Analysis and Design of a Least Material Orthotropic Pin Fin Heat Sinks,” Proceedings, IEEE ITHERM Conference, June 2006

Shoostari, A., Kahn, J., Bar-Cohen, A., Dessiatoun, S., Ohadi, M., Getz, M., and Norley, J., 2006,  “The Impact of a Thermal Spreader on the Temperature
Distribution in a Plasma Display Panel,” Proceedings, IEEE ITHERM Conference, June 2006

Bar-Cohen, A., Sher, I., Rahim, E., 2006, “On the Application of Macro-pipe Two-phase Heat Transfer Correlations and Flow Regime Maps to Mini-channels,” Proceedings of ASME Fourth International Conference on Nanochannels, Microchannels and Minichannels, Ireland .

Yang, B., Wang, P., Bar-Cohen, A.,2006, "Thermoelectric Mini-Contact Cooler for Hot-Spot Removal in High Power Devices," Proceedings, IEEE 2006 ECTC Conference  

Bar-Cohen, A., Wang, P., Yang, B., 2006, “On-Chip Hot Spot Thermal Management with an Embedded Array of Silicon Thermoelectric Microcoolers,“  Proceedings, IHTC-14, Sydney, Australia, Aug 13-18

Bahadur, R., Bar-Cohen, A., 2006, “Characterization and Modeling of Anisotropic Thermally Conductive Polymer Composite Pin Fins,” Proceedings, ASME IMECE Conference, Chicago, Ill, December

Wang. P., Bar-Cohen, A., 2006, “Analytical Modeling of On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers,” Proceedings, ASME IMECE Conference, Chicago, Ill, December

Wang, P., Bar-Cohen, A., Yang, B., 2007, “Enhanced Thermoelectric Cooler For On-Chip Hot Spot Cooling,” Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Wang, P., Bar-Cohen, A., 2007, “Simplified Thermal Model Of Silicon Thermoelectric Microcooler For On-Chip Hot Spot Remediation,” Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Geisler, K. and Bar-Cohen, A., 2007, “Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces,” Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Geisler, K. and Bar-Cohen, A., 2007, “Passive Immersion Cooling of 3-D Stacked Dies,” Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Khuu, V., Osterman, M., Bar-Cohen, A., Pecht, M., 2007, “Degradation Measurements of Thermal Interface Materials Using the Laser Flash Method,“ Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Kim, D.W., Rahim, E., Bar-Cohen, A., Han, B.T., 2007, “Thermofluid Characteristics Of Two-Phase Microgap Coolers, “Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)

Kahn, J., Bar-Cohen, A., 2007, “Thermal Modeling and Luminosity Characterization of a Plasma Display Panel,” Proceedings, ASME InterPack Conference, Vancouver, Canada, July 2007 (accepted)