Instructor:  Prof. Avram Bar-Cohen
Text Book:  Thermal Analysis and Control of Electronic Equipment, Allan D. Kraus and Avram Bar-Cohen, Hemisphere/McGraw Hill, 1984
Reference Book(s):       Lecture materials will also include information from the following sources:
1.  Lecture notes and Internet-based PowerPoint modules
2. Advances in Thermal Modeling of Electronic Components and Systems, A. Bar-Cohen and A.D. Kraus, Eds., Vol. 1 (Hemisphere Publishing Corp., 1988), Vol. 2 (ASME Press, 1990), Vol. 3 (ASME Press/IEEE Press, 1993), Vol 4 (ASME Press, 1998).
3. Design and Analysis of Heat Sinks, A.D. Kraus and A. Bar-Cohen, John Wiley and Sons, 1995.

Course Description: 
All microelectronic devices require power for their use, but nearly all this power is dissipated as heat. As a consequence, in operation the temperature of electronic devices rises and the elevated temperature can result in catastrophic failure, loss of function, or an accelerated failure rate for the electronic components, assemblies, and systems. Cost effective thermal management of micro/nano electronics is an enabling technology that can facilitate faster, more powerful, and more reliable computers, radar systems, data networks, IT operations, power grids, and a broad range of “intelligent” devices and products. .

Course Objectives:

• Systematically quantify the need for thermal management of electronic components
• Review the fundamental heat transfer mechanisms and identify the unique issues encountered in the cooling of electronic components
• Discuss current and future thermal management solutions for selected application areas.
• Conduct case studies and design projects to apply some of the fundamentals learned
• Benefit from peer learning through work in student teams, group project presentations, and extensive classroom discussions.

During the spring semester of 2007, this course will be taught in a “directed study” mode. Students will be expected to master material presented on the class website, work in small groups to complete assignments and Case Studies, and then present their results to the class and instructor. Full class meetings are scheduled for Thursdays to allow for discussion of the relevant material and to provide a forum for team and individual presentations.

Grading:
During the spring semester of 2007, grades in ENME765 will be based on the completion of 3 Case Study solutions (20% each) in teams and 2 individual reviews/critiques of archival journal papers (15%). The remaining 10% will be awarded for team participation and leadership in the classroom.

TOPICS:

Thermal Packaging - The Moving Frontier

Principles of Thermal Design

Thermal Contact Resistance/Thermal Interface Materials

Modeling Conduction/Compact Models in Chip Packages

Modeling Conduction in Printed Circuit Boards

Air-Cooled Heat Sinks: Modeling Approaches

Air Cooled Heat Sinks – Design for Manufacturability/Sustainability (no file)

Direct/Indirect Liquid Cooling Models and Correlations

Liquid Cooling Applications: Microchannel Coolers

On-Chip Thermoelectric Cooling

Liquid Cooling Applications: Heat Pipes / Immersion Modules (no file)