Research, Department of Mechanical Engineering, University of Maryland

Patents Issued in 2007

"Novel Configuration of Thermoelectric Coolers to High-Heat-Flux Hot Spots," (U.S. Patent 7,290,596) by Assistant Professor Bao Yang and Professor Avram Bar-Cohen was issued on November 6, 2007. The invention serves to concentrate the cooling effect of a miniaturized thermoelectric device so as to provide more efficient thermal management of localized “hot spots” on semiconductor devices.” Go here for more detailed information about this invention.
“Shadow Moiré Using Non-Zero Talbot Distance,” (U.S. Patent 7,230,722) was issued on June 12, 2007 to Professor Bongtae Han and colleague Dr. C.W. Han of the Reliability and Failure Analysis Center of the Korea Electronics Technology Institute. Their invention copes with the limitations of shadow moire encountered in high precision in-situ warpage measurements. Using the non-zero order Talbot distances, the dynamic range of measurements is increased substantially and high measurement sensitivity becomes practical, which are critically required for the warpage measurements of high-end microelectronics devices. Go here for more detailed information about this invention.
“Fiber Tip Based Sensor System for Measurements of Pressure Gradient, Air Particle Velocity and Acoustic Intensity,” (U.S. Patent 7,224,465) was issued on May 29, 2007 to Professor Balakumar Balachandran, Dr. Moustafa Al-Bassyiouni and Assistant Professor Miao Yu. Their invention helps realize a miniature fiber tip based sensor system for pressure measurements that can be used to detect acoustic and vibration fields over a broad frequency range. Go here for more detailed information about this invention.
“Electrohydrodynamically (EHD) Enhanced Heat Transfer System and Method with an Encapsulated Electrode,” (U.S. Patent 7,159,646) by Professor Michael Ohadi and Research Associate Professor Serguei V. Dessiatoun was approved by the U.S. Patent and Trade Office in early 2007. Their invention helps increase the efficiency of waste heat utilization in low temperature heat recovery applications as well as in low temperature power and refrigeration cycles.
Go here for more detailed information about this invention.
“Electromechanical Device Having a Plurality of Bundles of Fibers for Interconnecting Two Planar Surfaces,” (U.S. Patent 7,220,131) by Professor Michael Pecht, Joseph A. Swift, Stanley J. Wallace and Yuliang Deng, was approved by the U.S. Patent and Trade Office on May 22, 2007. The invention allows for the formation of separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. This can help reduce the thickness of interconnects, thus allowing redundancy and additional compliance as desired.
Go here for more detailed information about this invention.