ENME

Failure Analysis & Materials Characterization Laboratory

Location

  • 0128 Glenn L. Martin Hall, Building #088

Faculty

Staff

  • Dr. Michael Osterman - Research Scientist
  • Dr. Michael Azarian - Research Scientist
  • Mr. Bhanu Sood - Lab Director
 

Microtester
                       Microtester

This lab supports electronic product reliability assessment and assurance projects from industry and academia. View client list.

Current Capabalities

  • Thermomechanical Analysis
  • Dynamic Mechanical Analysis
  • Optical Microscopy and Microsectioning
  • Scanning Electron Microscopy
  • High Resolution X-ray Microscopy
  • X-ray fluorescence (XRF) spectrometer
  • Scanning Acoustic Microscopy
  • Energy-dispersive X-ray spectroscopy
  • Battery Testing
  • Electrical Testing
  • Wire bond pull testing
  • Solder shear testing
  • Cold ball pull testing

For more information, contact: services@calce.umd.edu

 

Delamination (seen in red) at molding compound and die interface
  Delamination (seen in red) at molding
         compound and die interface

Cross-sectioning of PWB
           Cross-sectioning of PWB

Intermetallic Growth between Wire Bond and Bond Pad
      Intermetallic Growth between
          Wire Bond and Bond Pad