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UMD     ENME



Failure Analysis & Materials Characterization Laboratory
      A member lab of the CALCE Electronic Products & Systems Center


Faculty

 

Microtester
Microtester

 

Current Capabilities

  • Decapsulating/Delidding
  • Microtesting
  • Energy Dispersive Microscopy and Spectorscopy
  • Focused Ion Bean (FIB) Imaging
  • Transmission Electron Microscopy
  • Assessment of Popcorning in PEMs
  • Differential Scanning Calorimetry
  • Thermomechanical Analysis
  • Dynamic Mechanical Analysis
  • Microidentiation
  • Contact Resistance Measurements
  • Ion Chromatography
  • Optical Microscopy and Microsectioning
  • Scanning Electron Microscopy
  • X-ray Microscopy
  • Scanning Acoustic Microscopy
  • Infrared Inspection System
  • Fourier Transform Infrared
  • Spectroscopy
  • Contact Resistance measurements
  • Atomic Force Microscopy

 


Cross-sectioning of Failed Capacitor

 

Stress testing
Delamination (seen in red) at
molding compound and die interface


Cross-sectioning of PWB


   Intermetallic Growth between
   Wire Bond and Bond Pad


Electrical Overstress


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