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Microtester
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- Decapsulating/Delidding
- Microtesting
- Energy Dispersive Microscopy and Spectorscopy
- Focused Ion Bean (FIB) Imaging
- Transmission Electron Microscopy
- Assessment of Popcorning in PEMs
- Differential Scanning Calorimetry
- Thermomechanical Analysis
- Dynamic Mechanical Analysis
- Microidentiation
- Contact Resistance Measurements
- Ion Chromatography
- Optical Microscopy and Microsectioning
- Scanning Electron Microscopy
- X-ray Microscopy
- Scanning Acoustic Microscopy
- Infrared Inspection System
- Fourier Transform Infrared
- Spectroscopy
- Contact Resistance measurements
- Atomic Force Microscopy

Cross-sectioning of Failed Capacitor
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Delamination (seen in red) at
molding compound and die interface

Cross-sectioning of PWB

Intermetallic Growth between
Wire Bond and Bond Pad

Electrical Overstress
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