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ME Ph.D. student Arindam Goswami recently won the 14th Motorola-IEEE CPMT Society Graduate Student Fellowship for Research on Electronic Packaging for his paper titled “Ultra-Fine Leak Detection of Hermetic Wafer Level Packages.” Goswami's paper was selected as the best of 22 submissions. His thesis advisor is Professor Bongtae Han. The award was presented at the 56th Electronic Components and Technology Conference (ECTC), held May 30 - June 2, 2006 in San Diego, California.
The Fellowship award is intended to promote graduate-level study and research on electronic packaging, and is given annually to a student enrolled full-time in a graduate curriculum leading to a Ph.D. and whose major field of interest is in electronic packaging. In 1992, Bob Galvin initiated the Fellowship, envisioning the need to promote graduate level study and research in electronic packaging.
June 15, 2006
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