ENME

News Story

Professors Han & Pecht Honored With IEEE Best Paper Award

Professors Han & Pecht Honored With IEEE Best Paper Award

Associate Professor of Mechanical Engineering Bongtae Han and Professor of Mechanical Engineering Michael Pecht were honored with the The Institute of Electrical and Electronics Engineers (IEEE) Transactions on Components and Packaging Technologies editor’s Best Paper Award of 2004.

Their paper, "Characterization of hygroscopic swelling behavior of mold compounds and plastic packages," co-written by Eric Stellrecht, was published in the September 2004 issue of Transactions. The paper was selected from nearly 100 manuscripts published in that year's volume of Transactions, which included many outstanding papers from authors from around the world.

The award will be presented at the upcoming 55th Electronic Components and Packaging Technology Conference (ECTC) in Lake Buena Vista (Orlando) Florida, during the CPMT Luncheon on Thursday, June 2, 2005.

The Award includes a $2500 cash prize (shared by the authors) and a certificate for each author. The department congratulates the authors on this wonderful recognition of their scholarship.

May 15, 2005


Prev   Next

Current Headlines

ARPA-E Spotlights UMD Awardee

CEEE Researchers Win ASHRAE Best Paper Award

Semiconductor quantum transistor opens the door for photon-based computing

Remembering Marilyn Berman Pollans

Supporting Diversity in Engineering

FPE Chair James Milke Recieves Award from Siemens

UMD Resilience Experts Host Project Management Training for Disaster Responders

Inspired by Nature: Autonomous Underwater Robotics

News Resources

Return to Newsroom

Search News

Archived News

Events Resources

Events Calendar

Additional Resources

UM Newsdesk

Faculty Experts