News Story

Avram Bar-Cohen Honored by IEEE

Avram Bar-Cohen Honored by IEEE

Department of Mechanical Engineering Chairman Avram Bar-Cohen was recently honored by the Components, Packaging and Manufacturing Technology Society of the IEEE. Dr. Bar-Cohen received the Outstanding Sustained Technical Contribution Award for his many contributions in the area of thermal management.

Dr. Bar-Cohen's research expertise is in thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology. In addition, he has become a pioneer in the research of nontraditional area of thermal packaging of electronic equipment. Dr. Bar-Cohen currently serves on the Steering Committee of the ASME Nanotechnology Institute and is Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002), and is editor-in-chief of the IEEE Transactions on Components & Packaging Technologies.

The Department of Mechanical Engineering offers their heartiest congratulations.

May 23, 2002

Prev   Next

Current Headlines

Prof. Yunho Hwang Recognized as ASHRAE Fellow

CALCE, Naval Air Warfare Center Partner for PIC Device Research

ARPA-E Spotlights UMD Awardee

CEEE Researchers Win ASHRAE Best Paper Award

Semiconductor quantum transistor opens the door for photon-based computing

Remembering Marilyn Berman Pollans

Supporting Diversity in Engineering

FPE Chair James Milke Recieves Award from Siemens

News Resources

Return to Newsroom

Search News

Archived News

Events Resources

Events Calendar

Additional Resources

UM Newsdesk

Faculty Experts