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Design of electronic packaging products with optimum mechanical reliability and
manufacturability. The specific applications of interest include Direct Chip
Attachment (DCA) with organic substrate, Small Outline Package (SOP), Ball Grid
Array (BGA) Package, etc. Optimization of mechanical design of electronic
packaging products are carried out by experimental methods (laser interferometry)
and numerical method (FEM).
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Develop a reliable low-cycle thermal fatigue failure mode for solder joint
reliability prediction. Characterize thermo-mechanical properties of
electronic packaging material, including temperature and/or time dependent
material properties and constitutive relationships of solder and polymers.
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Deformation analyses at material discontinuities, including interfaces in
multi-layered electronic subassemblies, grain boundaries in metals and ceramics,
and fiber/matrix interfaces in composites. Deformation analyses at geometrical
discontinuities, including crack and sharp notches.
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The Laboratory is currently equipped with classical and
modern interferometric displacement measurement techniques, including moiré and
microscopic moiré interferometry, Twyman/Green interferometry, Shadow moiré,
Photoelasticity, etc. Continuous development in 3-D displacement measurement
system for macro and micromechanics study are being progressed.
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Investigations of macro/micro mechanical behavior of composite material,
experimental study of failure modes and measurement of smeared engineering
properties of composite materials.
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