B. Han, R. Mahajan and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, Society for Experimental Mechanics, Bethel, CT, April 1997.

R. Mahajan, B. Han and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 2, Society for Experimental Mechanics, Bethel, CT, 1998.

D. Post, B. Han and P. Ifju, Chap. 24, “Moiré Interferometry,” Trends in Optical Nondestructive Testing and Inspection, R. K. Rastogi, D. Inaudi, ed., Elsvier Science, 2000.

B. Han et al., Chap. 2, “Strain Measurements at the Limit-the Moiré Microscope,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.

B. Han et al., Chap. 4, “Electronic Packaging,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.

B. Han, “14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.

A. Bar-Cohen, B. Han and K.-J. Kim, “2. Thermo-optic Effects on Polymer Bragg Grating,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.

B. Han and Y. Guo, "Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry," Journal of Electronic Packaging, Transaction of the ASME, Vol. 117, No. 3, 185-191 (1995).

B. Han and Y. Guo, "Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach," IEEE Transactions on Components, Packaging and Manufacturing Technology-Part A, Vol. 19, pp. 240-247, (1996).

B. Han, “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 119, No. 3, pp. 189-196 (1997).

B. Han, “Recent Advancement of Moiré and Microscopic Moiré Interferometry for Thermal Deformation Analyses of Microelectronics Devices, Experimental Mechanics, Vol. 38, No. 4, pp. 278-288 (1998).

B. Han and P. Kunthong, “Micro-mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-chip Package: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300 (2000).

K. Verma and B. Han, “Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122. No. 3, pp. 227-232 (2000).

(Invited Paper) B. Han, D. Post and P. Ifju, “Moiré Interferometry for Engineering Mechanics: Current Practice and Future Development”, Journal of Strain Analysis, Vol. 36, No. 1, pp. 101-117 (2001).

B. Han, Z. Wu and S. Cho, “Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moiré Interferometry,” Experimental Techniques, Vol. 25, No. 3, pp. 22-25, (2001).

K. Verma, B. Han, S.-.B Park, and W. Ackerman, “On the Design Parameters of Flip-chip PBGA Package Assembly for Optimum Solder Ball Reliability,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, (2001).

S.-M. Cho, S.-Y. Cho and B. Han, “Observing Real-Time Thermal Deformations in Electronic Packaging”, Experimental Techniques,” Experimental Techniques, Vol. 26, No. 3, pp. 25-29, (2002).

(Invited Paper) B. Han, “Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization using Photomechanics Methods,” Journal of Thermal Stresses, Vol. 26, pp. 583-613, (2003).

E. Stellrecht, B. Han, and M. Pecht, “Measurement of the Hygroscopic Swelling Coefficient in Mold Compounds Using Moiré Interferometry,” Experimental Techniques, Vol. 27, No. 4, pp. 40-44, (2003).

B. Han, S.-M. Cho, J. Joo, “Temperature Dependent Deformation Analysis of Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 126, pp. 1-7 (2004).

E. Stellrecht, B. Han and M. Pecht, “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp. 499-506 (2004).

J. Joo, S. Cho and B. Han, “Characterization of Flexural and Thermo-mechanical Behavior of Plastic Ball Grid Package Assembly Using Moiré Interferometry,” Microelectronics Reliability, Vol. 46, pp. 637-646 (2005).

B. Han, M. Chopra, S. Park, L. Li and K. Verma, “Effect of Substrate CTE on Solder Ball Reliability of Flip Chip Ball Grid Array Package Assembly,” Journal of Surface Mount Technology, SMTA, Vol. 9, pp. 25-34, (December 1996).

(Invited Paper) B. Han and Y. Guo, “Photomechanics Tools as Applied to Electronic Packaging Product Development,” B. Han, R. Mahajan and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, Society for Experimental Mechanics, Bethel, CT, (April 1997).

B. Han, “Optical Methods as Tools for Electronic Packaging Product Development,” Advanced Packaging, pp. 44-66, May/June 1997.

M. Variyam and B. Han, “DMD Module Calibration Using Interferometry,” TI Technical Journal, pp. 1-8, (June 2001).

S. Cho and B. Han, “Effect of Underfill on Flip-Chip Solder Bumps: An Experimental Study by Microscopic Moiré Interferometry,” The International Journal of Microcircuits and Electronic Packaging, Vol. 24, No. 3, pp. 217-239, (2002).

B. Han, “Optical Measurement of Flip-Chip Package Warpage and Its Effect on Thermal Interfaces,” Electronics Cooling, Vol. 9, No. 1, pp. 10-14 (2003).

B. Han, E. Stellrecht and M. Pecht, “Hygroscopic Swelling of Encapsulated Microcircuits: Part I New Measurement Technique Shows Deformation,” Advanced Packaging, pp. 31-33, June 2003.

B. Han, E. Stellrecht and M. Pecht, “Hygroscopic Swelling of Encapsulated Microcircuits: Part II Moisture Expansion Can Cause More Stress Than Thermal Expansion,” Advanced Packaging, pp. 29-30, July 2003.

C. Jang, S. Han and B. Han, “Predictive Modeling Solutions for Next Generation Fine Pitch LCD Driver IC Chip Package,” SAMSUNG Journal of Innovative Technology, Vol. 1, No. 1, pp. 271-284 (2005).

S. Yoon, S. Cho, Y. Lee and B. Han, “In-situ Displacement Measurement of Flex Package Subject to Thermal Shock Conditions,” Key Engineering Materials, Vols. 326-328 pp. 525-528 (2006)

Photomechanics Methods

Back to Top

Journals:

B. Han and D. Post, "The Tilted Plate Method for Introducing Carrier Fringes of Extension in Moiré Interferometry," Experimental Techniques, Vol. 13, No. 7, pp. 25-29 (1989).

B. Han and D. Post, "Immersion Interferometer for Microscopic Moiré Interferometry," Experimental Mechanics, Vol. 32, No. 1, pp. 38-41 (1992).

B. Han, "Higher Sensitivity Moiré Interferometry for Micromechanics Studies," Optical Engineering, Vol. 31, No. 7, pp. 1517-1526 (1992).

B. Han, P. Ifju and D. Post, "Geometric Moiré Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication," Experimental Mechanics, Vol. 33, No. 2, pp. 195-200 (1993).

B. Han, "Interferometric Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication," Applied Optics, Vol. 32, No. 25, pp. 4713-4718 (1993).

B. Han and A. L. Wang, "Isochromatic Fringe Sharpening and Multiplication," Experimental Techniques, Vol. 18, No. 6, pp. 11-13 (1994).

D. H. Mollenhauer, P. Ifju and B. Han, "A Compact, Robust, and Versatile Moiré Interferometer," Optics and Lasers in Engineering, Vol. 23, No. 1, pp. 29-40 (1995).

B. Han and A. L. Wang, "Isochromatic Fringe Sharpening and Interpolation along an Isoclinic Contour, with Applications to Fracture Mechanics," Experimental Mechanics, Vol. 36, No. 4, pp. 305-311 (1996).

B. Han, D. Columbus, Z. Wu and J. Lu “Mechanical Fringe Shifting in Moiré Interferometry,” Experimental Techniques, Vol. 23, No. 1, pp. 16-19 (1999).

K. Verma, D. Columbus and B. Han, “Development of Real Time/Variable Sensitivity Warpage Measurement Technique and its Application to Plastic Ball Grid Array Package,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 1, pp. 63-70 (1999).

K. Verma and B. Han, “Far Infrared Fizeau Interferometry,” Applied Optics, Vol. 40, No. 28, pp. 4981-4987, (2001).

K. Verma and B. Han, “Sensitivity Enhancement of Far Infrared Fizeau Interferometry by Digital Image Processing,” Optical Engineering, Vol. 40, No. 9, pp. 1970-1977, (2001).

M. Mello, B. Han and Z. Wang, “Infrared Diffraction Interferometer for Co-planarity Measurement of High Density Solder Bump Pattern,” Optical Engineering, Vol. 43, No. 4, pp. 888-894, (2004). 

Z. Wang and B. Han, “Advanced Iterative Algorithm for Phase Extraction of Randomly Phase-Shifted Interferograms,” Optics Letters, Vol. 29, No. 14, pp. 1671-1673, (2004). 

K. Verma and B. Han, “Real-time Observation of Thermally Induced Warpage of Flip-Chip Package Using Far Infrared Fizeau Interferometry,” Experimental Mechanics, Vol. 44, No. 6, pp. 628-633, (2004).

C. Han and B. Han, “Contrast of Shadow Moiré at High Order Talbot Distances,” Optical Engineering, Vol. 44, No. 2, 28002:1-6 (2005).

C. Han and B. Han, “Error Analysis of Phase Shifting Technique When Applied to Shadow Moiré,” Applied Optics, Vol. 45, No. 6, pp. 1124-1133 (2006).

C. Han and B. Han, “High Sensitivity Shadow Moiré Using Nonzero-Order Talbot Distance,” Experimental Mechanics, Vol. 46, pp. 543-554 (2006).

Advanced Engineering Materials Experimental Mechanics

Back to Top

J. Morton, D. Post, B. Han and M. Y. Tsai, "A Localized Hybrid Method of Stress Analysis: A Combination of Moiré Interferometry and FEM," Experimental Mechanics, Vol. 30, No. 2, pp. 195-200 (1990).

Y. Guo, D. Post and B. Han, "Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties, Journal of Composite Materials, Vol. 26, No. 13, pp. 1930-1944 (1993).

D. Post, J. D. Wood, B. Han, V. J. Parks and F. P. Gerstle, "Thermal Stresses in a Bimaterial Joint: An Experimental Analysis," Journal of Applied Mechanics, Vol. 61, No. 1, pp. 192-198, (1994).

B. Han, "Micromechanical Deformation Analysis of b alloy Titanium in Elastic and Elastic/Plastic Tension," Experimental Mechanics, Vol. 36, No. 2, pp. 120-126 (1996).

B. Han, "Micromechanical Thermal Deformation Analysis of Unidirectional Boron/Aluminum Metal-Matrix Composite," Optics and Lasers in Engineering, Vol. 24, pp. 455-466 (1996).

Z. Wu, J. Lu and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part I: Theory,” Journal of Applied Mechanics, Vol. 65, pp. 837-843 (1998).

Z. Wu, J. Lu, and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part II: Implementation,” Journal of Applied Mechanics, Vol. 65, pp. 844-850 (1998).

Z. Wang, J. F. Cárdenas-García and B. Han, “Inverse Method to Determine Elastic Constants Using a Circular Disc and Moiré Interferometry,” Experimental Mechanics, Vol. 45, No. 1, pp. 27-34 (2005).