Bongtae Han elected Fellow of ASME

http://www.enme.umd.edu/news/news_story.php?id=2432

Congratulations to Professor of Mechanical Engineering Bongtae Han, who has been elected a Fellow of the American Society of Mechanical Engineers (ASME).

The citation reads:

"Dr. Han serves critical industrial needs through measurement and interpretation of thermo-mechanical deformations of microelectronic and photonic devices. His contributions center around experimental analyses by optical techniques. He developed, extended and utilized special measurement means, including Moiré Interferometry, Micro-Moiré Interferometry, Far Infrared Fizeau Interferometry and Shadow Moiré, thereby providing insturmentation for, and analyses of, electronic package behavior; insturmentation that he developed is widely used in industry today. These experimental analyses provide critical guidance and verification for extensive computational analyses. Dr. Han disseminated his research and development accomplishments through extensive publications, presentations, patents and importantly through training of his students. His work has been a seminal contribution to the industry."

Han has received other prestigious honors in his accomplished career. He was awarded the ASME Associate Editor of the Year Award in 2005. He is also a Fellow in the Society for Experimental Mechanics (SEM) and an Associate Editor for ASME Transactions, Journal of Electronic Packaging.

Patent issued for “Shadow Moire Using Non-Zero Talbot Distance”

to Professor Bongtae Han and colleague Dr. C.W. Han of the Reliability and Failure Analysis Center of the Korea Electronics Technology Institute. Their invention copes with the limitations of shadow moire encountered in high precision in-situ warpage measurements. Using the non-zero order Talbot distances, the dynamic range of measurements is increased substantially and high measurement sensitivity becomes practical, which are critically required for the warpage measurements of high-end microelectronics devices. Go here or more detailed information about this invention.

Goswami Earns Ann G. Wylie Dissertation Fellowship Award

http://www.enme.umd.edu/news/news_story.php?id=2089

Mechanical Engineering Ph.D. candidate Arindam Goswami was awarded the Ann G. Wylie Dissertation Fellowship by the Graduate School of Maryland. Each fellowship awards a stipend of $10,000, candidacy tuition remission, financial assistance towards the cost of health insurance. The fellowship will provide financial support for either the fall 2007 or the spring 2008 semester, and was intended for students who are in the final stages of writing their dissertations.

The award supports Goswami’s research in “Quantitative Assessment of Hermeticity of Micro- to Nano-liter Scale Packages.” After graduating, he intends to apply his research to the characterization of current and future advanced MEMS packages.

Arindam Goswami Wins Motorola Fellowship

http://www.enme.umd.edu/news/news_story.php?id=1734

ME Ph.D. student Arindam Goswami recently won the 14th Motorola-IEEE CPMT Society Graduate Student Fellowship for Research on Electronic Packaging for his paper titled “Ultra-Fine Leak Detection of Hermetic Wafer Level Packages.” Goswami's paper was selected as the best of 22 submissions. His thesis advisor is Professor Bongtae Han. The award was presented at the 56th Electronic Components and Technology Conference (ECTC), held May 30 - June 2, 2006 in San Diego, California.

The Fellowship award is intended to promote graduate-level study and research on electronic packaging, and is given annually to a student enrolled full-time in a graduate curriculum leading to a Ph.D. and whose major field of interest is in electronic packaging. In 1992, Bob Galvin initiated the Fellowship, envisioning the need to promote graduate level study and research in electronic packaging.

Professor Han Named 2004 Associate Editor of the Year

http://www.enme.umd.edu/news/news_story.php?id=1716

Professor of Mechanical Engineering Bongtae Han was recently awarded the 2004 ASME Journal of Electronic Packaging Associate Editor of the Year Award. The award recognizes his technical and administrative service to the journal during the 2004 calendar year.

 The award was formally presented at the Electronic and Photonic Packaging technical division meeting during the 2006 ASME International Mechanical Engineering Congress & Exposition November 5-10 in Chicago, Illinois.

Professor Han Appointed SEM Fellow

http://www.enme.umd.edu/news/news_story.php?id=1696

Professor Bongtae Han was recently elevated to Fellow status as a member of the Society for Experimental Mechanics (SEM). Han receives this recognition for his notable contributions to the Society and to the field of Experimental Mechanics, specifically by his efforts in extending the applicability of moire interferometry into the micromechanics domain, development of new optical techniques, and stress analysis of multi-layer structures using photomechanics methods.

Han received recognition for the Fellows award at the 2006 SEM Annual Conference on Experimental Mechanics in St. Louis, Missouri on June 6, 2006.