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| Microscopic Moire Interferometry |
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| Example: |
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1. The specimen is a flip-chip PBGA package, subjected to an isothermal loading of
DT = -80°C. The top figure shows the micrograph
of a region near a solder bump with the largest DNP, where the solid lines indicate the
boundaries of the micro structures. The bottom pictures represent the U (or ux) and
V (or uy) displacement fields of the corresponding region, where the contour interval
is 0.052 mm (52 nm) per fringe. The in-plane
strains can be determined from the fringe patterns.
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2. U (or ux) displacement field of a metal matrix composite (boron fibers in aluminum
matrix), subjected to an isothermal loading of DT = -80°C. The contour interval is
0.052 mm (52 nm) per fringe. |
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