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Pecht, Michael

Michael Pecht
George E. Dieter Professor
Faculty Member, Applied Mathematics and Scientific Computation
Director, Center for Computer Aided Life Cycle Engineering
Department of Mechanical Engineering
Room S1103, Engineering Lab, (Building 089)
University of Maryland
College Park, MD 20742
Email: 
Phone: 
301-405-5323
Fax: 
301-314-9269

Research Interests 

  • Competitive product development
  • Product characterization and qualification
  • Supply chain creation and management
  • Prognostics and health management
  • Product reliability, risk assessment and mitigation

Background 

Professor Michael Pecht is the founder of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He has written more than twenty books on electronic products development, use and supply chain management and over 400 technical articles.  He consults for 22 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.

Full CV

Education 

  • Ph.D., in Engineering Mechanics from the University of Wisconsin at Madison
  • M.S.,  in Engineering Mechanics from the University of Wisconsin at Madison

Honors and Awards 

  • IEEE CPMT Technical Field Award (2016)
  • 2015 Applied Energy Award – most highly cited research paper. Xing, Y., W. He, and M. Pecht, “State of Charge Estimation of Lithium-ion Batteries Using the Open-circuit Voltage at Various Ambient Temperatures,” Applied Energy, Vol. 113, pp. 106–115, Jan. 2014.
  • Best Student Paper Award of Conference (2016): N. Jordan Jameson, Kai Wang, Carlos Morillo, Michael H. Azarian, and Michael Pecht, “Health Monitoring of Solenoid Valve Electromagnetic Coil Insulation under Thermal Deterioration,” Proceedings of MFPT 2016/ISA's 62nd IIS, Dayton, OH, May 24-26, 2016.
  • 2016 Chinese Academy of Sciences President's International Fellowship
  • Best paper award: Fan, J., ChengQian, Fan, X., Zhang, G., and M. Pecht, “In-situ Monitoring and Anomaly Detection for LED Packages Using a Mahalanobis Distance Approach,” The First International Conference on Reliability System Engineering & Prognostics and System Health Management Conference-Beijing (2015 ICRSE & PHM-Beijing), Beijing, China, October 23, 2015.
  • Awarded the distinction of “Honorary Professor” by the Harbin Institute of Technology (HIT) in Harbin, China, on July 16, 2015. The Honorary Professor award was granted to Prof Pecht for his technical expertise batteries and for his involvement with HIT in battery research. HIT was established in 1954 and is a member of the prestigious C9 League of Chinese universities. HIT was ranked 10th in the ranking of “Best Global Universities for Engineering” by U.S. News & World Report in 2015.
  •  2015 Distinguished Scientist: Chinese Academy of Sciences President’s International Fellowship.
  • IEEE Access was awarded the 2015 PROSE Award winner in the subject category of “Journal/Best New STM (Scientific, Technical, and Medical).”  Prof. Pecht is the Editor-in-Chief of IEEE Access. The American Publishers Award for Professional and Scholarly Excellence (PROSE) annually recognize the very best in professional and scholarly publishing by bringing attention to distinguished books, journals, and electronic content. IEEE Access was also a finalist for the Award for Excellence in Physical Sciences and Mathematics.
  • “Academic Excellence Award” by the Electronics Components Industry Association (ECIA). The award is used to recognize outstanding academic projects ‘that reference the application of advanced technologies for passive electronic components’. Peter, Anto, Michael H. Azarian, Michael Pecht, “Step Stress Testing of Electric Double Layer Capacitors,” International Capacitor and Resistor Technology Symposium, Santa Clara, CA, April 2014.
  • 2014 Corporate Connector of the Year from the University of Maryland, College Park: The Corporate Connector Award celebrates those individuals or units on campus that do the most to promote and connect UM with the private sector to advance research, partnerships, and scholarship.
  • 4th most cited article  in Transactions of the Institute of Measurement and Control over five years (2009 -2014): Pecht, M. and Gu, J., “Physics-of-failure-based Prognostics for Electronic Products,” Trans. of the Institute of Measurement and Control, Vol. 31, No. 3/4, pp. 309–322, 2009, DOI: 10.1177/0142331208092031
  • 2013: Received gift of $750k for research into automotive reliability from Hagans, Berman, Sobol, Shapiro LLP
  • 2013 IEEE Educational Activities Board/Standards Association (EAB/SA) Standards Education Award “for continued leadership in developing and promoting standards education in the field of reliability engineering.”
  • 2011 - University of Maryland Innovation Award
    for his new concepts in prognostics and systems health management.
  • 2010 - IEEE Exceptional Technical Achievement Award
  • 2010 - PMT Society Exceptional Technical Achievement Award 
    to recognize for exceptional technical achievement in the fields encompassed by the CPMT Society. “Dr. Pecht is recognized world wide for his seminal contributions in the area of electronics reliability from which he has developed a new and significant field of prognostics for electronics. This includes models that enable in-situ assessment of the deviation or degradation of a product from expected normal operating conditions and the prediction of the future state of reliability of that product. Michael's contributions in this area span more than 20 years and his subject matter expertise is disseminated in a book, several book chapters, handbooks, numerous articles, invited talks and short courses presented world wide.”
  • 2009 - National Defense Industrial Association award
    for CALCE for demonstrating outstanding achievement in the practical application of Systems Engineering principles, promotion of robust systems engineering principles throughout the organization, and effective systems engineering process development.
  • 2009 - University of Maryland Outstanding Faculty Research Award
    to recognize research contributions and exceptionally influential research accomplishments by engineering faculty.
  • 2008 - awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award
  • 2008 - The Alexander Schwarzkopf Prize for Technological Innovation
    awarded to National Science Foundation (NSF) Industry/University Cooperative Research Centers that have had a significant impact on the world. CALCE won the award for its research on physics-of-failure reliability analysis methods and advanced supply chain management concepts for electronic products and systems.
  • 2008 - Best Paper Award
    for the 62nd Meeting of the Society for Machinery Failure Prevention Technology. Gu, J., Barker D., and M. Pecht, “Prognostics of Electronics under Vibration Using Acceleration Sensors,” Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), Virginia Beach, VA, May 2008, pp. 253-263.
  • 2008 - Maurice Simpson Technical Editors Award
    for best 2007 article in IEST. Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee, and Joseph Clayton, for their paper, “Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads,” Journal of the IEST, Vol. 50, No. 1, pp. 86-97, April 2007.
  • 2008 - Japan Society for the Promotion of Science Fellowship
    for research in prognostics in electronics.
  • IEEE Reliability Society's Lifetime Achievement Award (2007) recognizes Prof. Pecht’s long term contributions to the Reliability Society, reliability research, and reliability education, all benefiting the reliability community.
  • European Micro and Nano-Reliability Award (2007) for outstanding contributions to reliability research.
  • Distinguished International Service Award (2006) for significant contributions to the development of international institutional programs at the University of Maryland; and a distinguished international career.
  • Grand Fellowship of the Mirce Academy, England (2005) the highest award that the Academy can bestow upon an individual in recognition of their unique contribution to the understanding and/or predicting of the motion of functionability through system life, at the global level of significance.
  • IEEE Best Paper of the Year (2004) Award for paper titled "Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages."
  • George E. Dieter Chair Professor of Mechanical Engineering, for significant contributions to the reputation of the Department, College and University with the establishment of CALCE Electronic Products and Systems Center (2001).
  • Kan Tong Po Award from the United Kingdom Royal Society
  • 3M Research Award for “research work in the electronics reliability area that has made significant contributions to the scientific understanding of material properties and their complex behavior.”
  • ASME Electrical and Electronic Packaging Division (EEPD) Award “for outstanding contributions to the field of application of engineering mechanics to electronic packaging.”
  • IEEE Undergraduate Teaching Award “for the development and realization of a cross disciplinary educational program in Computer Aided Life Cycle Engineering (CALCE).”
  • Outstanding paper of the year for the Microelectronics Int’l Journal, “Popcorning in PBGA Packages during IR Reflow Soldering,” P. McCluskey, R. Munamarty, and M. Pecht, Vol. 42 No.1 (1997).
  • ISHM/IEPS William D. Ashman Memorial Achievement Award, “for his numerous contributions to academia and the electronics packaging industry.”
  • IEEE Reliability Society’s Annual Reliability Award “for his contributions to the IEEE Transactions on Reliability, his work with CALCE Electronic Packaging Research Center and his work on Reliability Standards.”
  • American Society for Quality Control: Reliability Division Austin Bonis Award for the Advancement of Reliability Education for outstanding achievement in the advancement of reliability education.
  • Institute of Environmental Sciences Reliability Test and Evaluation Award (1996) “for vital contribution to the development and promotion of physics-of-failure modeling and analysis as a valuable reliability design and test process in the government, commercial and academic communities.”
  • IEEE Standards Award for Chairing and developing IEEE Standards Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment #1413 and IEEE Reliability Program Standard #1332.
  • NASA certificate of "recognition of your significant contributions in the preparation and execution of the successful Second US Microgravity Payload (USMP-2) Mission, launched on March 4, 1994."
  • International Electronic Packaging Society (IEPS) Educational Award "for excellence in research and education at the University of Maryland CALCE Electronics Packaging Research Center." (1990)
  • Best paper of the year (Maurice Simpson Technical Editors Award) for the Journal of the Institute of Environmental Sciences, "Reliabilty Prediction of Electronic Packages," May/June 1990.

Professional Memberships and Service 

  • Professional Engineer
  • Member, IEEE Standards Association
  • Chief Editor, Microelectronics Reliability International
  • Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing Technology

Fellowships

  • Fellow, Society of Automotive Engineering (SAE) (2010) "for his research and promotion of the reliability of the electronic parts and systems used in automotive and aerospace applications."
  • Fellow, International Microelectronics and Packaging Society (IMAPS)
  • Fellow, American Society of Mechanical Engineers (ASME) (1995), "for promoting the art, science, and practice of mechanical engineering."
  • Fellow, Institute of Electrical and Electronics Engineers (IEEE) (1992), "for effectiveness in leadership in the development and realization of an exemplary program and successful efforts to raise the level of engineering excellence and practice within and without the organization."

Selected Publications 

Books Authored/Edited

  • Ardebili, H., and M. Pecht, "Encapsulation Technologies for Electronic Applications, Materials and Processes for Electronic Applications Series," Elsevier Press, New York, NY, 2009.
  • Pecht, M., "Prognostics and Health Management of Electronics," John Wiley Publishing Co., New York, NY, 2008.
  • Pecht, M., "China's Electronics Industry, William Andrew Publishing," Norwich, NY, 2006.
  • Ganesan S. and M. Pecht, "Lead-Free Electronics," John Wiley Publishing Co., New York, NY, 2006.
  • Pecht, M., "Parts Selection and Management," John Wiley Publishing Co., New York, NY, 2004.
  • Liu, W. and M. Pecht, "IC Component Sockets," John Wiley & Sons, Inc., Hoboken, NJ, 2004.
  • Pecht, M., Bumiller, E., Pecht, J., and D. Douthit, "Contamination of Electronic Assemblies," CRC Press, Boca Raton, FL, 2002.
  • Pecht, M., Radojcic, R. and G. Rao, "Guidebook for Managing Silicon Chip Reliability," CRC Press, Boca Raton, FL, 1999.

Articles

2016

  • S. Padmanaban, M. Pecht, An Isolated/Non-Isolated Novel Multilevel Inverter Configuration for a Dual Three-Phase Symmetrical/Asymmetrical Star-Winding Converter, Eng. Sci. Tech., Int. J., Vol XX, pp XX, 2016.
  • George, E., M. Pecht, "RoHS compliance in safety and reliability critical electronics," Microelectronics Reliability, Vol. 65, pp. 1-7, October 2016.
  • M. Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, and Edward Cripps, A Fusion Prognostics-based Qualification Test Methodology for Microelectronic ProductsMicroelectronics Reliability, Vol 63, pp 320-324, August 2016, DOI:10.1016/j.microrel.2016.04.002
  • Woo, S. and Pecht, M., "Reliability Design of Residential-Sized Refrigerators Subjected to Repetitive Random Vibration Loads during Transportation", Athens: ATINER'S Conference Paper Series, No: TRA2016-1981. (2016).

2010

  • Sood, B., and M. Pecht, “Effect of Moisture on Thermal Properties of Halogen-free and Halogenated Printed Circuit Board Laminates,” Trans. on Device and Materials Reliability, 2010.
  • Wang, W., and M. Pecht, “Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-frame under Temperature Cycling,” J. of ASTM International, 2010.
  • Tiku, S. and M. Pecht, “Validation of Reliability Capability Evaluation Model: Using a Quantitative Assessment Process,” Int’l J. of Quality & Reliability Management, Vol. 27. Iss. 8, 2010.
  • Hirohata, K., K. Hisano, M. Mukai, H. Aoki, C. Takubo, T. Kawakami, and M. Pecht, “Coupled Thermal-stress Analysis for FC-BGA Packaging Reliability Design,” IEEE Trans. on Components and Packaging Technologies, Vol. 33, No. 2, pp. 347-358, June 2010.
  • Sotiris, V., P.W. Tse and M. Pecht, “Anomaly Detection through a Bayesian Support Vector Machine,” IEEE Trans. on Reliability, Vol. 59, No. 2, pp. 277-286, June 2010.
  • Nie, L., M. Osterman, and M. Pecht, “Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions,” IEEE Trans. on Device and Materials Reliability, Vol. 10, No. 2, pp. 276-286, June 2010.
  • Pecht, M., “A Prognostics and Health Management Roadmap for Information and Electronics-Rich Systems,” IEICE Fundamentals Review, Vol. 3, No. 4, pp. 25-32, April, 2010.
  • Wang, W., D. Banjevic, and M. Pecht, “A Multi-component and Multi-failure Mode Inspection Model based on the Delay Time Concept,” Reliability Engineering and System Safety, April 2010.
  • Sood, B., R. Sanapala, D. Das, M. Pecht, C.Y. Huang and M.Y. Tsai, “Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-free Soldering,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 33, No. 2, pp. 98-111, April 2010.
  • Pecht, M., and R. Jaai, “A Prognostics and Health Management Roadmap for Information and Electronics-rich System,” Microelectronics Reliability, Vol. 50, Iss. 3, pp. 317-323, March 2010.
  • Zhang, S., M. Osterman, A. Shrivastava, R. Kang, and M. Pecht, “The Influence of H2S Exposure on Immersion-Silver-Finished PCBs under Mixed-Flow Gas Testing,” IEEE Trans. on Device and Materials Reliability, Vol. 10, No. 1, pp. 571-81, March 2010.
  • Challa, V., L.D. Lopez, M. Osterman, and M. Pecht, “Stress Relaxation Testing of Stamped Metal Land-Grid-Array Sockets,” IEEE Trans. on Device and Materials Reliability, Vol. 10, No. 1, pp. 55-61, March 2010.
  • Kumar, S., E. Dolev and M. Pecht, “Parameter Selection for Health Monitoring of Electronic Products,” Microelectronics Reliability, 50, pp. 161-168, 2010.
  • Tiku, S. and M. Pecht, “Validation of Reliability Capability Evaluation Model Using a Quantitative Assessment Process,” Int’l Journal for Quality and Reliability Management, Vol. 27, Issue 8, 2010.
  • Woo, S.W., D. O’Neal, and M. Pecht, “Failure Analysis and Redesign of the Evaporator Tubing in a Kimchi Refrigerator,” Engineering Failure Analysis 17, pp. 369-379, 2010.
  • Woo, S.W., D. O’Neal, and M. Pecht, “Reliability Design of a Reciprocating Compressor Suction Reed Valve in a Common Refrigerator Subjected to Repetitive Pressure Loads,” Engineering Failure Analysis 17, pp. 979-991, 2010.

2009

  • Gu, J., D. Barker, and M. Pecht, “Health Monitoring and Prognostics of Electronics Subject to Vibration Load Conditions,” IEEE Sensors Journal, Vol. 9, Iss. 11, pp. 1479-1485, Nov. 2009.
  • Nie, L., M. Osterman, F. Song, J. Lo, S.W. Lee, and M. Pecht, “Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages,” IEEE Trans. on Components and Packaging Technology, Vol. 32, No. 4, pp. 901-908, Dec. 2009.
  • Pecht, M., and L. Zuga, “China as Hegemon of the Global Electronics Industry: How It Got That Way and Why It Won’t Change,” Open Forum, IEEE Trans. on Components and Packaging Technology, Vol. 32, No. 4, pp. 935-939, Dec. 2009.
  • Yang, S. J. Wu and M. Pecht, “Reliability Assessment of Land Grid Array Sockets Subjected to Mixed Flowing Gas Environment,” IEEE Trans. on Reliability, Vol. 58, No. 4, pp. 634-640, Dec. 2009.
  • Sanapala, R., B. Sood, D. Das and M. Pecht, “Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board laminates,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 32, No. 4, pp. 272-280, Oct. 2009.
  • Gu, J., N. Vichare, E. Tinsley, and M. Pecht, “Computer Usage Monitoring for Design and Reliability Tests,” IEEE Trans. on Components and Packaging Technologies, Vol. 32, No. 3, pp. 550-556, Sept. 2009.
  • Kumar, S., and M. Pecht, “Baseline Performance of Notebook Computers under Various Environmental and Usage Conditions for Prognostics,” IEEE Trans. on Components and Packaging Technologies, Vol. 32, No. 3, pp. 667-676, Sept. 2009.
  • Nie, L., M. Osterman, M. Pecht, F. Song, J. Lo, and S.W. Lee, “Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages,” IEEE Trans. on Components and Packaging Technology, Vol. 32, No. 3, Sept. 2009.
  • Chauhan, P., M. Osterman, S.W. Lee, and M. Pecht, “Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability,” IEEE Trans. on Components and Packaging Technologies, Vol. 32, No. 3, pp. 693-700, Sept. 2009.
  • Khuu, V., M. Osterman, A. Bar-Cohen and M. Pecht, “Effects of Temperature Cycling and Elevated Temperature/Humidity on the Thermal Performance of Thermal Interface Materials,” IEEE Trans. on Device and Materials Reliability, Vol. 9, No. 3, pp. 379-391, Sept. 2009.
  • Tsai, M.Y., H.Y. Chang and M. Pecht, “Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading,” IEEE Trans. on Device and Materials Reliability, Vol. 9, No. 3, pp. 419-424, Sept. 2009.
  • Lopez, L., and M. Pecht, “Modeling of IC Socket Contact Resistance for Reliability and Health Monitoring Applications,” IEEE Trans. on Reliability, Vol. 58, No. 2, pp. 264-270, June 2009.
  • Patil, N., J. Celaya, D. Das, K. Goebel, and M. Pecht, “Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics,” IEEE Trans. on Reliability, Vol. 58, No. 2, pp. 271-276, June 2009.
  • Qi, H., M. Osterman and M. Pecht, “A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions,” IEEE Trans. on Components and Packaging Technologies, Vol. 32, No. 2, pp. 283-292, June 2009.
  • Kwon, D., M.H. Azarian, and M. Pecht, “Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance,” IEEE Trans. on Device and Materials Reliability, Vol. 9, No. 2, pp. 296-304, June 2009.
  • Gu, J., and M. Pecht, “Physics-of-failure-based Prognostics for Electronic Products,” Trans. of the Institute of Measurement and Control 31, 3/4, pp. 309-322, 2009.
  • Shibutani, T., Q. Yu and M. Pecht, “Tin Whisker Reliability in Microelectronics,” Micromaterials and Nanomaterials, Iss. 09, pp. 49-53, 2009.
  • Nie, L., M. Osterman and M. Pecht, “Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies,” Journal of Surface Mount Technology, Vol. 22, Iss. 2, pp. 13-20, 2009.
  • Woo, S.W., D. O’Neal and M. Pecht, “Improving the Reliability of a Water Dispenser Lever in a Refrigerator Subjected to Repetitive Stresses,” Engineering Failure Analysis, 16, pp. 1597-1606, 2009.
  • Woo, S.W., D. O’Neal and M. Pecht, “Design of a Hinge Kit System in a Kimchi Refrigerator Receiving Repetitive Stresses,” Engineering Failure Analysis, 16, pp. 1655-1665, 2009.
  • Gu J. and M. Pecht, “Health Assessment and Prognostics of Electronic Products: an Alternative to Traditional Reliability Prediction Methods,” Electronics Cooling, Vol. 15, No. 2, pp. 10-17, May 2009.
  • Woo, S.W., M. Pecht, and D. O’Neal, “Reliability Design and Case Study of a Refrigerator Compressor Subjected to Repetitive Loads,” Int’l J. of Refrigeration, Vol. 32, No. 3, pp. 478-486, May 2009.
  • Lopez, L.D., V. Challa, and M. Pecht, “Assessing the Reliability of Elastomer Sockets in Temperature Environments,” IEEE Trans. on Device and Materials Reliability, Vol. 9, No. 1, pp. 80-86, March 2009.
  • Shibutani, T., M. Osterman, and M. Pecht, “Standards for Tin Whisker Test Methods on Lead-Free Components,” IEEE Trans. on Components and Packaging Technologies, Vol. 32, No. 1, pp. 216-219, March 2009.
  • Woo, S.W., D. Ryu and M. Pecht, “Design Evaluation of a French Refrigerator Drawer System Subjected to Repeated Food Storage Loads,” Engineering Failure Analysis (16), pp. 2224-2234, March 2009.
  • Mathew, S., M. Osterman, M. Pecht, and F. Dunlevey, “Evaluation of Pure Tin Plated Copper Alloy Substrates for Tin Whiskers,” Circuit World, Vol. 35, No. 1, pp. 3-8, 2009.
  • Elerath, J.G., and M. Pecht, “A Highly Accurate Method for Assessing Reliability of Redundant Arrays of Inexpensive Disks (RAID),” IEEE Trans. on Computers, Vol. 58, No. 3, pp. 289- 299, March 2009.
  • Qi, H., M. Osterman, and M. Pecht, “Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package under Various Manufacturing and Multiple Environmental Loading Conditions,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 32, Iss. 1, pp. 32-40, Jan. 2009.

2008

  • Kumar, S., V. Sotiris, and M. Pecht, “Health Assessment of Electronic Products using Mahalanobis Distance and Projection Pursuit Analysis,” Int’l Journal of Computer, Information, and Systems Sciences, and Engineering, 2;3, pp. 242-250, Fall 2008.
  • Shibutani, T., Q. Yu, M. Shiratori, and M. Pecht, “Pressure-induced Tin Whisker Formation,” Microelectronics Reliability, 48, pp. 1033-1039, 2008.
  • Lantz, L., M. Pecht and M. Wood, “The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass Spectroscopy,” IEEE Trans. on Components and Packaging Technologies, Vol. 31, No. 3, pp. 527-545, Sept. 2008.
  • Woo, S.W., D. O’Neal, and M. Pecht, “Improving the Reliability of a Water Dispenser Lever in a Refrigerator Subjected to Repetitive Stresses,” Engineering Failure Analysis, Vol. 15, No. 8, Nov. 2008.
  • Singh, R. and M. Pecht, “Commercial Impact of Silicon Carbide- Opportunities and Challenges in Realizing the Full Potential of SiC Power Devices,” IEEE Industrial Electronics Magazine, pp. 19-31, Sept. 2008.
  • Yang, D., Y. C. Chan, B. Y. Wu, and M. Pecht, “Electromigration and Thermomigration Behavior of Flip Chip Solder Joints in High Current Density Packages,” Journal of Materials Research, Vol. 23, No. 9, pp. 2333-2339, Sept. 2008.
  • Woo, S. and M. Pecht, “Failure Analysis and Redesign of a Helix Upper Dispenser,” Engineering Failure Analysis, 15, Issue 6, pp. 642-653, Sept. 2008.
  • Qi, H., M. Osterman, and M. Pecht, “Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach,” IEEE Trans. on Advanced Packaging, Vol. 31, No. 3, pp. 463-472, August 2008.
  • Qi, H., N. Vichare, M. Azarian, and M. Pecht, “Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products,” IEEE Trans. on Components and Packaging Technologies, Vol. 31, No. 2, pp. 469-477, June 2008.
  • Qi, H., Q. Zhang, E. Tinsley, M. Osterman, and M. Pecht, “High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints,” IEEE Trans. on Components and Packaging Technologies, Vol. 31, No. 2, pp. 309-314, June 2008.
  • Zhan, S., M. Azarian, and M. Pecht, “Reliability of Printed Circuit Boards Processed Using No-clean Flux Technology in Temperature-Humidity-Bias Conditions,” IEEE Trans. on Device and Materials Reliability, Vol. 8, No. 2, pp. 426-434, June 2008.
  • Qi, H., S. Ganesan and M. Pecht, “No-Fault-Found and Intermittent Failures in Electronic Products,” Microelectronics Reliability, Vol. 48, Issue 5, pp. 663-674, May 2008.
  • Keimasi, M., M. Azarian, and M. Pecht, “Flex Cracking of Multilayer Ceramic Capacitors Assembled with Pb-Free and Tin-Lead Solders,” IEEE Trans. on Device and Materials Reliability, Vol. 8, No. 1, pp.182-192, March 2008.
  • Choubey, A., M. Osterman, and M. Pecht, “Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached with SnPb Solder Under Isothermal Aging,” IEEE Trans. on Device and Materials Reliability, Vol. 8, No. 1, pp.160-167, March 2008.
  • Wang, W., Y.C. Chen, and M. Pecht, “Anisotropic Conductive Adhesives for Flip-chip Interconnects,” Journal of Adhesion Science & Technology, Volume 22, Numbers 8-9, pp. 871-892, 2008.

2007

  • Vichare, N., P. Rodgers, V. Eveloy, and M. Pecht, “Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design,” Quality Technology & Quantitative Management, Vol. 4, No. 2, pp. 235-250, 2007.
  • Deng Y., M. Pecht, J. Swift, and S.J. Wallace, “Carbon Fiber-Based Grid Array Interconnects,” IEEE Trans. on Components and Packaging Technologies, Vol. 30, No. 4, pp. 716-723, Dec. 2007.
  • Gu, J., D. Barker and M. Pecht, “Prognostics Implementation of Electronics under Vibration Loading,” Microelectronics Reliability, Vol. 47, No. 12, pp. 1849-1856, Dec. 2007.
  • Keimasi, M., M. Azarian and M. Pecht, “Isothermal Aging Effects on Flex Cracking of Multilayer Ceramic Capacitors with Standard and Flexible Terminations,” Microelectronics Reliability, Vol. 47, No. 12, pp. 2215-2225, Dec. 2007.
  • Kostoff, R.N., M. Briggs, R.L. Rushenberg, C. Bowles, M. Pecht, D. Johnson, S. Bhattacharya, A. Icenhour, K. Nikodym, R. Barth and S. Dodbele, “Comparison of the Structure and Infrastructure of Chinese and Indian Science and Technology,” Science Direct, Vol. 74, No. 9, pp. 1609-1630, Nov. 2007.
  • Kostoff, R.N., M. Briggs, R.L. Rushenberg, C. Bowles, A. Icenhour, K. Nikodym, R. Barth and M. Pecht, “Chinese Science and Technology- Structure and Infrastructure,” Science Direct, Vol. 74, No. 9, pp. 1539-1573, Nov. 2007.
  • Kostoff, R.N., S. Bhattacharya and M. Pecht, “Assessment of China’s and India’s Science and Technology Literature, Technological Forecasting and Social Change," Science Direct, Vol 74, No. 9, pp. 1519-1538, Nov. 2007.
  • Qi, H., M. Osterman, and M. Pecht, “Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications,” IEEE Trans. on Components and Packaging Technologies, Vol. 30, No. 2, pp. 242-247, June 2007.
  • Tiku, S., M. Azarian, and M. Pecht, “Using a Reliability Capability Maturity Model to Benchmark Electronics Companies,” Int’l Journal of Quality & Reliability Management, Vol. 24, No. 5, pp. 547-563, 2007.
  • Nie, L., M. Pecht, and R. Ciocci, “Regulations and Market Trends in Lead-free and Halogen-free Electronics,” Circuit World, Vol. 33, No. 2, pp. 4-9, 2007.
  • Mathew, S., D. Das, M. Osterman, M. Pecht, J. Clayton, and R. Ferebee, “Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads,” Journal of the IEST, Vol. 50, No. 1, pp 86- 97, April 2007.
  • Sengupta, S., D. Das, S. Ganesan, W. Rollins, D. Pinsky, T. Lin and M. Pecht, “Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 128-137, April, 2007.
  • Fang, T., S. Mathew, M. Osterman and M. Pecht, “Assessment of Risk Resulting from Unattached Tin Whisker Bridging,” Circuit World, Vol. 33, No. 1, pp. 5-8, 2007.
  • Yang, S., J. Wu, D. Tsai and M. Pecht, “Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket,” IEEE Trans. on Components and Packaging Technologies, Vol. 30, Issue 1, pp. 81-85, March 2007.
  • Eveloy, V., Y. Hwang, and M. Pecht, “The Effect of Electrostatic Discharge on Electrical Overstress Susceptibility in a Gallium Arsenide MESFET-Based Device,” IEEE Trans. on Device and Materials Reliability, Vol, 7, No. 1, pp. 200-208, March 2007.
  • Fukuda, Y., M. Osterman and M. Pecht, “The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth,” Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, Jan. 2007.
  • Fukuda, Y., M. Osterman and M. Pecht, “Length Distribution Analysis for Tin Whisker Growth,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 30, No. 1, pp. 36-40, Jan. 2007.

2006

  • Zhao, P., M. Pecht, S. Kang and S. Park, “Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Preplated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests,” IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, Dec. 2006.
  • Deng Y., M. Pecht and K. Rogers, “Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy,” IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 4, pp. 804-808, Dec. 2006.
  • Mathew, S., D. Das, M. Osterman, M. Pecht and R. Ferebee, “Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board,” J. of Electronic Packaging, Vol. 128, pp. 339-345, Dec. 2006.
  • Zhan, S., M. Azarian and M. Pecht, “Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 217-223, July 2006.
  • Pecht, M., “Establishing a Relationship between Warranty and Reliability,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 184-190, July 2006.
  • Rogers, K., and M. Pecht, “A Variant of Conductive Filament Formation Failures in PWBs with 3 and 4 mil Spacings,” Circuit World, Vol. 32, No. 3, pp. 11-18, 2006.
  • Wu, J. and M. Pecht, “Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts,” IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 2, pp. 402-410, June 2006.
  • Huang, Y., D. Bigio, and M. Pecht, “Investigation of the Size and Spatial Distribution of Fillers in Mold Compounds after Device Packaging,” IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 2, pp. 364-370, June 2006.
  • Vichare, N.M., P. Rodgers and M. Pecht, “Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management,” Int’l Journal of Performability Engineering, Vol. 2, No. 2, pp. 149-161, April 2006.
  • Donahoe, D., M. Pecht, I.K. Lloyd, and S. Ganesan, “Moisture Induced Degradation of Multilayer Ceramic Capacitors,” Microelectronics Reliability, Vol. 46, pp. 400-408, April 2006.
  • Pecht, M. and D. Humphrey, “Uprating of Electronic Parts to Address Obsolescence,” Microelectronics International, Vol. 23, (2), pp. 32-36, 2006.
  • Ciocci, R., and M. Pecht, “Impact of Environmental Regulations on Green Electronics Manufacture,” Microelectronics International, Vol. 23, (2), pp. 45-50, 2006.
  • Choubey A., D. Menschow, S. Ganesan and M. Pecht, “Effect of Aging on Pull Strength of SnPb, SnAgCu, and Mixed Solder Joints in Peripheral Surface Mount Components,” Journal of SMT, Vol. 19, Issue 2, pp. 33-37, April-June 2006.
  • Fang T., M. Osterman, and M. Pecht, “Statistical Analysis of Tin Whisker Growth,” Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.
  • Vichare, N. and M. Pecht, “Prognostics and Health Management of Electronics,” IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 1, pp. 222-229, March 2006.
  • Pecht, M. and Y. Deng, “Electronic Device Encapsulation Using Red Phosphorus Flame Retardants,” Microelectronics Reliability, Vol. 46, Issue 1, pp. 53-62, January, 2006.
  • Ganesan S., and M. Pecht, “Open Trace Defects in FR4 Printed Circuit Boards,” Circuit World, Vol. 32, No. 1, pp. 3-7, 2006.

2005

  • Eveloy, V., S. Ganesan, Y. Fukuda, J. Wu, and M. Pecht, “Are You Ready for Lead-Free Electronics?” IEEE Trans. on Components and Packaging Technologies, Vol. 28, No. 4, pp. 884-894, Sept. 2005.
  • Tiku, S., A. Veneruso, R. Etchells and M. Pecht, “ Risk Factors in Oil and Gas Well Electronics Compared to Other Electronic Industries,” Oil & Gas Science and Technology – Institut francais du petrole, Rev. IFP, Vol. 60, No. 4, pp. 721-730, 2005.
  • Pecht, M., A. Ramakrishnan, J. Fazio, and C.E. Nash, “The Role of U.S. National Highway Traffic Safety Administration in Automotive Electronics Reliability and Safety Assessment,” IEEE Trans. on Components and Packaging Technologies, Vol. 28, No. 3, pp. 571-580, Sept. 2005.
  • Huang, Y., S. Zhan, D. Bigio and M. Pecht, “Distribution of a Minor Solid Constituent in a Transfer Molded e-Pad Leadframe Package,” IEEE Trans. on Components and Packaging Technologies, Vol. 28, No. 3, pp. 549-554, Sept. 2005.
  • Zhao, P. and M. Pecht, “Mixed Flowing Gas Studies of Creep Corrosion on Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-Plated Leadframes,” IEEE Trans. on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.
  • Donahoe, D and M. Pecht, “New Aging Mechanism in Multilayer Ceramic Capacitators,” Advanced Packaging, June 2005.
  • Lin, T.Y., M. Pecht, D. Das, J. Pan and W. Zhu, “The Evaluation of Copper Migration during the Die Attach Curing and Second Wire Bonding Process,” Components and Packaging Technologies, IEEE Trans. on Components and Packaging Technologies, Vol. 28, No. 2, pp. 337-344, June 2005.

2004

  • Vichare, N., P. Rodgers, V. Eveloy, and M. Pecht, “In Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics,” IEEE Trans. on Devices and Materials Reliability, Vol. 4, No. 4, pp. 658-663, Dec. 2004.
  • Eveloy, V., P. Rodgers and M. Pecht, “Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies,” IEEE Trans. on Devices and Materials Reliability, Vol. 4, No. 4, pp. 650-657, Dec. 2004.
  • Pecht, M., Y. Fukuda and S. Rajagopal, “The Impact of Lead-free Legislation Exemptions on the Electronics Industry,” IEEE Trans. on Electronics Packaging Manufacturing, Vol. 27, No. 4, pp. 221-232, October 2004.
  • Murray S., C. Hillman and M. Pecht, “Environmental Aging and Deadhesion of Polyimide Dielectric Films,” Journal of Electronic Packaging, Vol. 126, pp. 390-397, Sept. 2004.
  • Stellrecht, E., B. Han and M. Pecht, “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages,” IEEE Trans. on Components and Packaging Technologies. Vol. 27, No. 3, pp. 499-506, Sept. 2004.
  • Huang, Y., D. Bigio and M. Pecht, “Fill Pattern and Particle Distribution of Underfill Material,” IEEE Trans. on Components and Packaging Technologies. Vol. 27, No. 3, pp. 493-498, Sept. 2004.
  • Lee, M. and M. Pecht, “Thermal Assessment of Glass-Metal Composition Plasma Display Panels Using Design of Experiments,” IEEE Tran. On Components and Packaging Technologies, Vol. 27, No. 1, pp. 210-216, March 2004.
  • Xie, J., M. Sun, M. Pecht and D. Barbe, “Why Gold Flash can be Detrimental to Long-term Reliability,” Journal of Electronic Packaging, Vol. 126, Issue 1, pp. 37-40, March 2004.
  • Ciocci, R. and M. Pecht, “Questions Concerning the Migration to Lead-free Solder,” Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.
  • Casey P. and M. Pecht, “Assessing Lead-free Intellectual Property,” Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.
  • Ramakrishnan, A. and M. Pecht, “Load Characterization During Transportation,” Microelectronics Reliability, Vol. 44, No. 2, pp. 333-338, Feb. 2004.

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Edward B. Magrab honored at reception recognizing distinguished service to campus and department. May 16, 2007

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