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McCluskey, F. Patrick

F. Patrick McCluskey
Professor
Department of Mechanical Engineering
3135 Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD 20742
Email: 
Phone: 
301-405-0279
Fax: 
301-314-9477

Research Interests 

  • High temperature and high power electronics packaging, materials, and reliability

Education 

  • Ph.D., Lehigh University, 1991
  • M.S., Lehigh University, 1986
  • B.S., Lafayette College, 1984

Professional Memberships and Service 

  • Associate Editor, IEEE Components and Packaging Technologies
  • Co-organizer of Symposium N: Microelectronics and Microsystem Packaging, Materials Research Society Spring Meeting (2001)
  • Organizing Committee and Short Course Director, Fifth International High Temperature Electronics Conference (June 2000)
  • Member, NSF Proposal Review Panel on Materials Processing and Manufacturing
  • Technical Program Chair, IMAPS International Conference on High Temperature Electronics, (2004, 2006, 2008)
  • Technical Program Committee for SIA Int'l Conference on Automotive Power Electronics (2009)
  • Organizing Committee for the CIPS Conference (2010, 2012)
  • Organizing Committee for IMAPS European High Temperature Electronics Conference (2009, 2011)

Selected Publications 

2009

  • P. Quintero, F. P. McCluskey, "Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment," J. Microelectronics and Electronic Packaging,  Vol. 6, pp. 66-74.  (2009).
  • R. W. Chang and F. P. McCluskey, "Reliability Assessment of Indium Solder for Low Temperature Electronic Packaging," Cryogenics, 49 (11), pp. 630-634 (2009).

2006

  • F. P. McCluskey, M. Dash, Z. Wang, and D. Huff, "Reliability of High Temperature Solder Alternatives," Microelectronics Reliability, Vol. 46, No. 9-11, pp. 1910-1914 (2006).

2004

  • Chandrasekaran and F. P. McCluskey, "Effect of Green Molding Compounds on High Temperature Wirebond Reliability," Micromaterials and Nanomaterials, Issue 3. Vol. 2004.  pp. 134-143, (2004).

2003

  • K. Meyyappan, P. McCluskey, and L. Chen, "Thermomechanical Analysis of Gold-Based SiC Die Attach Assembly," IEEE Trans Device and Materials Reliability, Vol. 3, No. 4. pp. 152-158, (2003).

2001

  • McCluskey, F.P., "Fatigue and Intermetallic Formation in Lead Free Soldier Die Attach," Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 9-13, 2001, Kauai, HI.
  • McCluskey, F.P., "A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics," Proceedings of the Electronic Component and Technology Conference, Lake Buena Vista, FL, May 30, 2001, pp. 397-400.

2000

  • McCluskey, F.P., K. Mensah, C. O'Connor, and A. Gallo, " Reliable Use of Commercial Technology in High Temperature Environments," Microelectronics Reliability, Vol. 40, pp. 1671-1678 (2000).
  • McCluskey, F.P., Y.D. Kweon, H.J. Lee, J.W. Kim, and H.S. Jeon, "Method for Assessing Remaining Life in Electronics Assembles," Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306 (2000).

1998

  • Palli, N., S. Azarm, F.P. McCluskey, and R. Sundararajan, "An Interactive Multistage e-Inequality Constraint Method for Multiple Objectives Decision Making," Journal of Mechanical Design, Vol. 120, pp. 678-686 (December 1998).
  • R.R. Grzybowski and F.P. McCluskey, "High Temperature Performance of Polymer Film Capacitors," Journal of Microelectronic Packaging, Vol. 1, pp. 153-158 (1998).
  • McCluskey, P., F. Lilie, O. Beysser, A. Gallo, “Low Temperature Delamination of Plastic Encapsulated Microcircuits,” Microelectronics Reliability, Vol. 38, No. 12, pp. 1829-1834 (December 1998).
  • McCluskey, F.P., E.B, Hakim, J. Fink, A. Fowler, and M. Pecht, “Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-360 (June 1998).

1997

  • McCluskey, F.P., M.B. Wright, and D. Humphrey, "Uprating Electronic for Use Outside their Temperature Specifications Limits,"  IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 2, pp. 252-256 (1997).
  • McCluskey, F.P., D. Das, J. Jordan, R.R. Grzybowski, J. Fink, L. Condra, and T.C. Torri, "Packaging of Electronics for High Temperature Applications," The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, pp. 409-423 (1997).
  • McCluskey, F.P., R. Munamarty, and M. Pecht, "Popcorning in PBGA Packages During IR Reflow Soldering," Microelectronics International, No. 42, pp. 20-23 (1997).

1996

  • McCluskey, F.P., R.R. Grzybowski, and T.F. Podlesak, eds., "High Temperature Electronics," CRC Press, Boca Raton, FL (1996).

Related News 

Clark School Faculty Promotions Announced
Faculty promoted to full professor, associate professor with tenure. June 5, 2014

Offshore Wind Energy and Reliability
Clark School professors support the State of Maryland's efforts to establish a resilient wind farm. May 25, 2014

Exploring Offshore Wind Energy for Maryland
Md. Higher Education Commission funds Clark School study of reliability, cost-effectiveness of wind-generated energy. September 10, 2013

Khaligh is PI for hybrid energy storage system NSF GOALI grant
New lightweight system will offer increased battery life for electric cars. September 3, 2013

"Embedded Cooling" of Next-Generation Power Electronics
UMD Research Team wins $2.1 million contract from DARPA to develop "embedded cooling" technology May 24, 2013

Mechanical Engineering Graduates Placed in Academia
Pedro Quintero and William McGill return to the classroom as Assistant Professors April 20, 2009

Department Well-Represented at OTC Invention Awards
Professors Baz & McCluskey earn top recognition. April 26, 2007

2006 ME Research Review Day Highlights
Research Review Day held on March 20, 2006 at the University Inn and Conference Center. February 15, 2006

Workshop on Power Device Packaging Reliability Held
Associate Professor Patrick McCluskey hosted Workshop on Power Device Packaging Reliability at UMD. June 23, 2003