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Peter SandbornDr. Peter Sandborn
Professor of Mechanical Engineering

3127 Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD 20742

Phone: 301.405.3167
Fax: 301.314.9477
Email: sandborn@umd.edu
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Research Interests

Electronic packaging and reliability; life cycle cost analysis of electronic systems; technology obsolescence management (DMSMS); technology tradeoff analysis; supply chain management and parts selection and management for electronic systems; prognostics and health management (PHM) for electronic systems; design for environment of electronic systems.


Education

Ph.D., University of Michigan, 1987


Select Publications


Scientific and Professional Membership

Invited Speaker: MIT, Virginia Tech, Georgia Tech, Chalmers University, Loughborough University; Associate Editor: IEEE Transactions on Electronics Packaging Manufacturing; Editorial board of the International Journal of Performability Engineering;Conference chair and program chair: ASME Design for Manufacturing and Life Cycle Conference; Program Committee: IEEE Multichip Module Conference; SIA CAD Tool roadmap, NEMI Passive Components Technology Working Group; Reviewer: IEEE Transactions on Electron Devices, IEEE Transactions on Circuits and Systems, IEEE Transactions on Components, Packaging, and Manufacturing Technology–Parts A, B, C, IEEE Transactions on VLSI, IEEE Design & Test of Computers, Journal of Industrial Ecology, Design Automation Conference (DAC), INTERpack Conference.


Honors and Awards

The Engineering Economist journal 2006 Best Paper Award, for “Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems;” SOLE Proceedings Paper Award for best paper published during 2004 for "Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronics Systems.”  2009 Poole and Kent Teaching Award for Senior Faculty.

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