Mechanical Engineering Faculty Profile:

Dr. Peter Sandborn
Associate Professor of Mechanical Engineering

Electronic packaging and reliability; life cycle cost analysis of electronic systems, technology tradeoff analysis, supply chain management and parts selection and management for electronic systems; design for environment of electronic systems; microelectromechanical systems (MEMS)

(301) 405-3167 | sandborn@calce.umd.edu | website |  Room 3127, Bldg 088, Martin Hall

Education
Ph.D., University of Michigan, 1987

Honors and Awards
The Engineering Economist journal 2006 Best Paper Award, for “Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems.”

Recent Publications
P. Singh and P. Sandborn, "Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems," The Engineering Economist, Vol. 51, No. 2, pp. 115-139, April-June 2006.

Trichy, T., P. Sandborn, R. Raghavan, and S. Sahasrabudhe, “A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly,” Proc. IEEE International Test Conference, October 2001.

Sandborn, P.A., B. Etienne, and G. Subramanian, “Application-Specific Economic Analysis of Integral Passives,” IEEE Trans. on Electronics Packaging Manufacturing, July 2001.

Becker, D., and P. Sandborn, “On the Use of Yielded Cost in Modeling Electronic Assembly Processes,” IEEE Trans. on Electronics Packaging Manufacturing, July 2001.

Solomon, R., P. Sandborn, and M. Pecht, “Electronic Part Life Cycle Concepts and Obsolescence Forecasting,” IEEE Trans. on Components and Packaging Technologies, pp. 707-713, December 2000.

Sandborn, P., R. Swaminathan, G. Subramanian, M. Deeds, and K. Cochran, “Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices,” Proc. ITHERM, pp. 133-140, May 2000.

Scientific and Professional Membership
Invited Speaker: MIT, Virginia Tech, Georgia Tech, Chalmers University; Associate Editor: IEEE Transactions on Electronics Packaging Manufacturing; Program Committee: IEEE Multichip Module Conference; SIA CAD Tool roadmap, NEMI Passive Components Technology Working Group; Reviewer, IEEE Transactions on Electron Devices, IEEE Transactions on Circuits and Systems, IEEE Transactions on Components, Packaging, and Manufacturing Technology–Parts A, B, C, IEEE Transactions on VLSI, IEEE Design & Test of Computers, Journal of Industrial Ecology, Design Automation Conference (DAC), INTERpack Conference

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