Mechanical Engineering Faculty Profile:

Dr. Michael Pecht
George E. Dieter Professor of Mechanical Engineering

Competitive product development; product characterization and qualification; supply chain creation and management; prognostics and health management; product reliability, risk assessment and mitigation

(301) 405-5278 | pecht@umd.edu |  Room S1103, Engineering Lab, (Building 089)

Vita
Michael Pecht is a Chair Professor and the Director of The Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. Michael Pecht has a BS in Acoustics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow and an ASME Fellow. He has received the 3M Research Award for electronics packaging, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in electronics reliability analysis. He has written twenty-six books on electronic products development, use and supply chain management. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He is the founder of CALCE (Center for Advanced Life Cycle Engineering) and the Electronic Products and Systems Consortium at the University of Maryland. He is also a Chair Professor. He has been leading a research team in the area of prognostics for the past ten years, and has now formed a new Electronics Prognostics and Health Management Consortium at the University of Maryland. He has consulted for over 50 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.

Education
Ph.D., University of Wisconsin (Madison), Professional Engineer, State of Maryland

Books Authored/Edited
Pecht, M., China's Electronics Industry, William Andrew Publishing, Norwich, NY, 2006.

Ganesan S. and M. Pecht, Lead-Free Electronics, John Wiley Publishing Co., New York, NY, 2006.

Pecht, M., Parts Selection and Management, John Wiley Publishing Co., New York, NY, 2004.

Liu, W. and M. Pecht, IC Component Sockets, John Wiley & Sons, Inc., Hoboken, NJ, 2004.

Pecht, M., Bumiller, E., Pecht, J., and D. Douthit, Contamination of Electronic Assemblies, CRC Press, Boca Raton, FL, 2002.

Pecht, M., Radojcic, R. and G. Rao, Guidebook for Managing Silicon Chip Reliability, CRC Press, Boca Raton, FL, 1999.

Articles
Choubey A., D. Menschow, S. Ganesan and M. Pecht, "Effect of Aging on Pull Strength of SnPb, SnAgCu, and Mixed Solder Joints in Peripheral Surface Mount Components," Journal of SMT, Vol. 19, Issue 2, pp. 33-37, April-June 2006.

Mathew, S., M. Osterman and M. Pecht, "Tin Whisker Bridging Across Electrical Conductors," Proc. of 2nd Int'l Eco-electronics Conf., Beijing, China, pp. 17-20, Dec. 7-8, 2006.

Deng Y., M. Pecht and K. Rogers, "Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy," IEEE Trans. on Components and Packaging Technologies, Vol. 29, No. 4, pp. 804-808, Dec. 2006.

Mathew, S., D. Das, M. Osterman, M. Pecht and R. Ferebee, "Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board," J. of Electronic Packaging, Vol. 128, pp. 339-345, Dec. 2006.

Pecht, M., "Establishing a Relationship between Warranty and Reliability," IEEE Trans. on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 184-190, July 2006.

Ganesan, S., G. Kim, J. Wu, M. Pecht and J. Felba, "Lead-free Assembly Defects in Plastic Ball Grid Array Package, 5th Int'l IEEE Conference on Polymers and Adhesives in Microelectronic and Photonics, Wroclaw, pp. 219-223, 2005.

Huang, Y., S. Zhan, D. Bigio and M. Pecht, "Distribution of a Minor Solid Constituent in a Transfer Molded e-Pad Leadframe Package," IEEE Trans. on Components and Packaging Technologies, Vol. 28, No. 3, pp. 549-554, Sept. 2005.

Vichare, N., P. Rodgers, V. Eveloy, and M. Pecht, "In Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics," IEEE Trans. on Devices and Materials Reliability, Vol. 4, No. 4, pp. 658-663, Dec. 2004.

Fellowship
Fellow, American Society of Mechanical Engineers (ASME) (1995), “for promoting the art, science, and practice of mechanical engineering;" Fellow, Institute of Electrical and Electronics Engineers (IEEE) (1992), "for effectiveness in leadership in the development and realization of an exemplary program and successful efforts to raise the level of engineering excellence and practice within and without the organization."

Scientific and Professional Membership
Chief Editor, Microelectronics Reliability International, Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing Technology, Associate Editor, International Microelectronics Journal, Editorial Board, KSME International Journal, Korean Society of Mechanical Engineers, Chairman, IEEE Reliability Standards 1332, 1413, 1413.1

Honors and Awards
IEEE Reliability Society Lifetime Achievement Award (2007); Distinguished International Service Award (2006) for significant contributions to the development of international institutional programs at the University of Maryland; and a distinguished international career, Grand Fellowship of the Mirce Academy, England (2005): the highest award that the Academy can bestow upon an individual in recognition of their unique contribution to the understanding and/or predicting of the motion of functionability through system life, at the global level of significance, IEEE Best Paper of the Year (2004) Award: for paper titled "Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages", George E. Dieter Chair Professor of Mechanical Engineering, for significant contributions to the reputation of the Department, College and University with the establishment of CALCE Electronic Products and Systems Center (2001). Kan Tong Po Award from the United Kingdom Royal Society, 3M Research Award for “research work in the electronics reliability area that has made significant contributions to the scientific understanding of material properties and their complex behavior”, ASME Electrical and Electronic Packaging Division (EEPD) Award “for outstanding contributions to the field of application of engineering mechanics to electronic packaging”, IEEE Undergraduate Teaching Award “for the development and realization of a cross disciplinary educational program in Computer Aided Life Cycle Engineering (CALCE)”, Outstanding paper of the year for the Microelectronics Int’l Journal, “Popcorning in PBGA Packages during IR Reflow Soldering,” P. McCluskey, R. Munamarty, and M. Pecht, Vol. 42 No.1 (1997), ISHM/IEPS William D. Ashman Memorial Achievement Award, “for his numerous contributions to academia and the electronics packaging industry”, IEEE Reliability Society’s Annual Reliability Award, “for his contributions to the IEEE Transactions on Reliability, his work with CALCE Electronic Packaging Research Center and his work on Reliability Standards”, American Society for Quality Control: Reliability Division, Austin Bonis Award for the Advancement of Reliability Education for outstanding achievement in the advancement of reliability education, Institute of Environmental Sciences Reliability Test and Evaluation Award (1996), “for vital contribution to the development and promotion of physics-of-failure modeling and analysis as a valuable reliability design and test process in the government, commercial and academic communities”, IEEE Standards Award for Chairing and developing IEEE Standards Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment #1413 and IEEE Reliability Program Standard #1332, NASA certificate of "recognition of your significant contributions in the preparation and execution of the successful Second US Microgravity Payload (USMP-2) Mission, launched on March 4, 1994.", International Electronic Packaging Society (IEPS) Educational Award "for excellence in research and education at the University of Maryland CALCE Electronics Packaging Research Center." (1990), Best paper of the year (Maurice Simpson Technical Editors Award) for the Journal of the Institute of Environmental Sciences, "Reliabilty Prediction of Electronic Packages," May/June 1990.

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