Mechanical Engineering Faculty Profile:

Dr. F. Patrick McCluskey
Associate Professor of Mechanical Engineering

3135 Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD  20742

Phone: 301.405.0279
Fax: 301.314.9477
Email: mcclupa@umd.edu
Website

Research Interests

High temperature electronic packaging; computer-aided risk assessment of microelectronics.

Education

Ph.D., Lehigh University, 1991
M.S., Lehigh University, 1986
B.S., Lafayette College, 1984

Select Publications

• McCluskey, F.P., "Fatigue and Intermetallic Formation in Lead Free Soldier Die Attach," Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 9-13, 2001, Kauai, HI.
• McCluskey, F.P., "A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics," Proceedings of the Electronic Component and Technology Conference, Lake Buena Vista, FL, May 30, 2001, pp. 397-400.
• McCluskey, F.P., K. Mensah, C. O'Connor, and A. Gallo, " Reliable Use of Commercial Technology in High Temperature Environments," Microelectronics Reliability, Vol. 40, pp. 1671-1678 (2000).
• McCluskey, F.P., Y.D. Kweon, H.J. Lee, J.W. Kim, and H.S. Jeon, "Method for Assessing Remaining Life in Electronics Assembles," Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306 (2000).
• Palli, N., S. Azarm, F.P. McCluskey, and R. Sundararajan, "An Interactive Multistage e-Inequality Constraint Method for Multiple Objectives Decision Making," Journal of Mechanical Design, Vol. 120, pp. 678-686 (December 1998).
• R.R. Grzybowski and F.P. McCluskey, "High Temperature Performance of Polymer Film Capacitors," Journal of Microelectronic Packaging, Vol. 1, pp. 153-158 (1998).
• McCluskey, P., F. Lilie, O. Beysser, A. Gallo, “Low Temperature Delamination of Plastic Encapsulated Microcircuits,” Microelectronics Reliability, Vol. 38, No. 12, pp. 1829-1834 (December 1998). 
• McCluskey, F.P., E.B, Hakim, J. Fink, A. Fowler, and M. Pecht, “Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-360 (June 1998).
• McCluskey, F.P., M.B. Wright, and D. Humphrey, "Uprating Electronic for Use Outside their Temperature Specifications Limits,"  IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 2, pp. 252-256 (1997).
• McCluskey, F.P., D. Das, J. Jordan, R.R. Grzybowski, J. Fink, L. Condra, and T.C. Torri, "Packaging of Electronics for High Temperature Applications," The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, pp. 409-423 (1997).
• McCluskey, F.P., R. Munamarty, and M. Pecht, "Popcorning in PBGA Packages During IR Reflow Soldering," Microelectronics International, No. 42, pp. 20-23 (1997).
• McCluskey, F.P., R.R. Grzybowski, and T.F. Podlesak, eds., High Temperature Electronics, CRC Press, Boca Raton, FL (1996).

Scientific and Professional Membership

Associate Editor, IEEE Components and Packaging Technologies; North American Regional Editor of Microelectronics International; Co-organizer of Symposium N:  Microelectronics and Microsystem Packaging, Materials Research Society Spring Meeting 2001; Organizing Committee and Short Course Director, Fifth International High Temperature Electronics Conference, June 2000; Member, NSF Proposal Review Panel on Materials Processing and Manufacturing.

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