Mechanical Engineering Faculty Profile:

Dr. Bongtae Han
Professor of Mechanical Engineering

3147 Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD 20742

Phone: 301.405.5255
Fax: 301.314.9477
Email: bthan@umd.edu
Website

Research Interests

Design of LED-based lighting system, Mechanical design of photonics and microelectronics devices; Hermeticity of MEMS devices; Moisture and gas diffusion in flexible electronics; Experimental micro and nanomechanics (optical methods and methodologies).

Education

Ph.D., Virginia Polytechnic Institute and State University, 1991

Select Publications
Book:

• D. Post, B. Han and P. Ifju, High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials, Mechanical Engineering Series, Springer-Verlag, NY, 1994. (Student edition, 1997)

Book Chapters:

• B. Han and D. Post, Chap 21, “Geometric Moire,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, 2008.
• D. Post and B. Han, Chap 22, “Moire Interferometry,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, 2008.

Journals:

• K. J. Kim, A. Bar-Cohen and B. Han, “Thermo-Optical Modeling of Intrinsically Heated Polymer Fiber Bragg Grating,” Applied Optics, Vol. 46, No. 20 , pp. 4437-4370 (2007).
  
• S. Yoon, B. Han and Z. Wang, “On Moisture Diffusion Modeling Using Thermal-Moisture Analogy,” Journal of Electronic Packaging, Vol. 129, pp. 421-426 (2007).
• Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen and P. Joseph, “Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating,” Experimental Mechanics, Vol. 48, pp. 107-117 (2008).
• Goswami and B. Han, “On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages,” IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21 (2008).
• C. Jang, Y. Cho and B. Han, “Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films,” Applied Physics Letters, Vol. 93, 13307 (2008).
• Goswami and B. Han, “On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes”, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).
• Jang and B. Han, “Analytical Solutions of Gas Transport Problems in Inorganic/Organic Hybrid Barrier Structures,” Journal of Applied Physics, 105, 093532 (2009).
• Goswami, B. Han, S.-J. Ham and B.-G. Jeong, “Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009). 
• Jang, A. Goswami and B. Han, “Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).

Scientific and Professional Membership

Associate Editor, ASME Transactions, Journal of Electronic Packaging (2004-present); Member of International Editorial Board, Journal of Experimental Mechanics, (2005–); Associate Editor, Experimental Mechanics (2001-2004); Executive Board Member, Society for Experimental Mechanics (1997-1999); Member of the Scientific Committee, CompTest 2008; Member of the Scientific Committee, Photomechanics 2008, Member of the Organizing Committee, The 7th International Conference on Advanced Technology in Experimental Mechanics (ATEM'07); Symposium Chair, The 1st International Symposium on Optical Methodologies and Metrologies for Microelectronics and Photonics.

Honors and Awards

IBM Excellence Award - for Outstanding Technical Achievements, 1994.
Brewer Award - Outstanding Experimental Stress Analyst, Society for Experimental Mechanics, 2001.
Gold Award (the best paper in the Analysis and Simulation session) - The 1st Samsung Technical Conference, November 9-12, 2004.
2004 Best Paper Award - IEEE Transactions on Components and Packaging Technologies, 2005.
Fellow - Society for Experimental Mechanics (SEM), 2006.
2004 Associate Editor of the Year Award - ASME Journal of Electronic Packaging, 2006.
Fellow - American Society for Mechanical Engineers (ASME), 2007.

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