Mechanical Engineering Faculty Profile:

Dr. Donald Barker
Professor of Mechanical Engineering

2110B Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD  20742

Phone: 301.405.5264
Fax: 301.314.9477
Email: dbarker@umd.edu
Website

Research Interests

Electronic packaging; experimental mechanics; fracture mechanics; dynamic (high strain rate) material behavior; CAE/CAD/CALCE.

Education

Ph.D., University of California (Los Angeles), 1976

Vita

Dr. Donald B. Barker is a faculty member and head of the PWB and Modules Lab in the CALCE center. He has published extensively in the general area of experimental mechanics, fracture, fatigue, dynamic material response, and electronic packaging. Through his many active interactions with industrial contacts and his strong academic background in failure analysis, Dr. Barker is turning his attention to practical approaches in microelectronic package reliability prediction modeling.

Select Publications

• Cluff, K. and D.B. Barker, “Tailoring Surface-Mount Solder Joint Fatigue Tests Using Integrated Field Damage Information,” Journal of the Institute of Environmental Sciences and Technology, July/August 1998, pp 36-42; awarded the 1999 Maurice Simpson Award from the IEST (best paper).
• Mahajan, R., B. Han and D. Barker, Experimental/ Numerical Mechanics in Electronic Packaging, Volume 2, Society for Experimental Mechanics, 1998.
• Cluff, K., D. Robbins, T. Edwards, and D.B. Barker, “Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment,” Journal of the Institute of Environmental Sciences and Technology, July/August 1997, pp 22-28; awarded the 1997 Maurice Simpson Award from the IEST (best paper).
• Han, B., D. Barker and R. Mahajan, Experimental/ Numerical Mechanics in Electronic Packaging, Volume 1, Society for Experimental Mechanics, 1997.
• L.L. Roy, D.B. Barker and H. Tomey, “Experimental Determination of the Shear Modules of Compliant Adhesives Using Single Lap Shear Tests,” Experimental/ Numerical Mechanics in Electronic Packaging, Volume 1, edited by B. Han, D. Barker, and R. Mahajan, Society for Experimental Mechanics, pp. 93-101, 1997.

Fellowship

American Society of Mechanical Engineers (ASME)

Scientific and Professional Membership

Session chairman at SEM Spring Annual Meeting June 2001 and ASME Winter Annual Meeting November 2000; Reviewer, ASME Journal of Electronic Packaging, SEM Journal of Experimental Mechanics; Member of ASME, IEEE, IEST, IEPS, IMAPS, American Academy of Mechanics, American Society of Testing and Materials, Institute of Environmental Sciences, Institute for Interconnecting and Packaging Electronic Circuits, International Society for Hybrid Microelectronics, Society for Experimental Mechanics

Honors and Awards

American Men of Science; Who’s Who in Engineering; Fellow of American Society of Mechanical Engineers; Outstanding George Washington University Alumni Award (1987); NSF Sustained Superior Performance Award (1981)

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