Mechanical Engineering Faculty Profile:

Dr. Avram Bar-Cohen
Department Chair
Distinguished University Professor of Mechanical Engineering

2181B Glenn L. Martin Hall, Building 088
University of Maryland
College Park, MD 20742

Phone: 301.405.3173
Fax: 301.314.9477
Email: abc@umd.edu

Research Interests

Thermal management of Micro/Nano systems, including thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology.

Education

Ph.D., Massachusetts Institute of Technology, 1971

Select Publications

• Kraus, A. D. and Bar-Cohen, A. 1995, Design and Analysis of Heat Sinks, John Wiley and Sons, Inc., New York, (2nd printing 1997).
• Afgan, N., da Graca Carvalho, M., Bar-Cohen, A., Butterworth, D., and Roetzel, W., (editors), 1996, "New Developments in Heat Exchangers," Gordon and Breach Publishers, Australia.
• Bar-Cohen, A. and Kraus, A.D., Editors, 1999, Wiley Series in Thermal Management of Microelectronic and Electronic Systems: Incropera, F.P., Liquid Cooling of Electronic Devices by Single-Phase Convection, John Wiley and Sons, Inc., New York.
• Bar-Cohen, A., Celata, G.P., Klausner, J., Fujita, Y., Editors, 2000, Boiling 2000: Phenomena and Emerging Applications, Vol. 1 & 2, (Proceedings UEF Conference, Anchorage, Alaska, May 2000), Begell House, NY, 2000.
• Bhavnani, S.H, Bar-Cohen, A., and Joshi, Y., 2000, The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics, Journal of Engineering Education, pp 423-427.
• Momoki, S., A. Bar-Cohen, and A.E. Bergles, 2000, Estimation of Major Correlations for Frictional Pressure Drop in Gas-Liquid Two-Phase Flow in Horizontal Pipes Using Predicted Flow Regime Information, Multiphase Science and Technology, Vol. 12, Nos. 3&4, pp 161-175.
• Cardozo, R., Durfee, W., Ardichvili, A., Adams, C., Erdman, A., Hoey, M., Iaizzo, P., Mallick, D., Bar-Cohen, A., Beachy, R., Johnson, A., 2002, Experiential Education In New Product Design and Business Development, accepted for publication, Journal of Product Innovation Management, Vol. 19, pp 4-17.
• Yazawa, K., Solbrekken, G., and Bar-Cohen, A., 2002, Modeling and Analysis of Heat Driven Forced Convection Cooling, Thermal Science & Engineering Vol. 10, No. 5, pp 29-36, Heat Transfer Society of Japan.
• Bar-Cohen, A. and Iyengar, M., 2002, Design and Optimization of Air-cooled Heat Sinks for Sustainable Development, IEEE CPT Transactions, Vol. 25, No. 4, pp 584-591.
• Arik, M. and Bar-Cohen, A., 2003, Effusivity-Based Correlation of Surface Property Effects in Pool Boiling CHF of Dielectric Liquids, International Journal of Heat and Mass Transfer, Vol. 46, pp 3755-3764.
• Afgan, N., Carvalho, M. Prstic, S., Bar-Cohen, A., 2003, Sustainability Assessment of Aluminum Heat Sink Design, Heat Transfer Engineering, 24 (4), pp 39-48.
• Iyengar, M., and Bar-Cohen, A., 2003, Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development, IEEE CPT Transactions, Vol. 26, No. 1, pp 16-25.
• Narasimhan, S., Bar-Cohen, A., Nair, R., 2003, Thermal Compact Modeling of Parallel Plate Heat Sinks, Vol. 26, Number 1, IEEE CPT Transactions, pp 136-146.
• Narsimhan, S., Bar-Cohen, A., Nair, R., 2003, Flow and Pressure Field Characteristics in the Porous Block Compact Modeling of Parallel Plate Heat Sinks, IEEE CPT Transactions, Vol. 26, No. 1, pp 147-157.
• Bar-Cohen, A. , Iyengar, M, and Kraus, A.D., 2003, Design of Optimum Plate Fin Natural Convection Heat Sinks, ASME Transactions - Journal of Electronic Packaging, Vol. 125, No. 2, pp 208-216.

Scientific and Professional Membership

ASME Activities: Editor, Advances in Heat Transfer (2005), Member, Executive Committee, Mechanical Engineering department Heads Committee (2004-2005); Member, Assembly for International Heat Transfer Conferences (2002-2006); Member, Steering Committee, Nanotechnology Institute, 2001-2004; Vice-President for Research, Board on Research and Technology Development (1998-2001); Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002); Member, Executive Committee, Board on Research and Technology Development (1995-1998); Chair (1981-1985), Member (1986- ) K-16 Committee for Heat Transfer in Electronic Equipment; Chair, BRTD Research Committee on Packaging and Physical Design of Electronic Equipment (1988-1990); Secretary, BRTD Technical Opportunities and Planning Committee, 1989-1992; Member, ASME Board on Professional Development (1989-1995); Associate Editor, ASME Transactions Journal of Mechanical Design, 1978-1982; Associate Editor, ASME Applied Mechanics Reviews, 1985-1991 IEEE Activities: Editor-in-Chief of the IEEE/CPMT Transactions on Components and Packaging Technologies (1995-2005); Member, IEEE/CPMT Board of Governors (1995-2005); Vice-chairman of the IEEE/CHMT TC-9 Committee on Thermal Control (1990-1993); Other Activities: MEDHC Executive Committee, Keynote Lecture, "Design and Optimization of Air-Cooled Heat Sinks for Sustainable Development," NSF-sponsored Workshop on Thermal Challenges in Next Generation Electronic Systems (THERMES 2002), January 2002, Santa Fe, New Mexico.

Honors and Awards

1983 ASME Fellow; 1992 ASME Dedicated Service Award "for his work in Professional Development;" 1994 ASME Edwin F. Church Medal, "In recognition of contributions to engineering education, continuing education and professional development on both the national and international levels;" 1993 IEEE Fellow; 1994 ASME Electronic and Electrical Packaging Division, Outstanding Contribution Award "For outstanding contributions to application of Heat Transfer Science to Electronic Packaging;" 1994-1997 ASME Distinguished Lecturer; 1997 IEEE/Semi-Therm THERMI Significant Contributor Award "For his many contributions to the thermal management of semiconductors;" 1998 ASME/IEEE ITHERM Memorial Award "For significant contributions to the field of thermal and thermomechanical engineering for electronics packaging;" 1999 ASME Heat Transfer Memorial Award "For work contributing to a greater understanding of immersion cooling, pool boiling of dielectric fluids, and other aspects of electronics cooling;" 1999 ASME Curriculum Innovation Award, Board on Engineering Education, for "The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics," (with S. Bhavnani and Y. Joshi); 2000 ASME Worcester Reed Warner Medal, "..for outstanding contributions to the literature in the area of heat transfer, including more than 180 technical papers, and pioneering research and experimentation in electronic cooling and natural convection;" 2000 IEEE Distinguished Lecturer; 2002 IEEE CPMT Society, Outstanding Sustained Technical Contributions Award, "for contributions to thermal design, modeling, and analysis and for original research on ebullient and liquid-phase cooling."

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