ENME Department Chair
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Dr. Avram Bar-Cohen Phone: 301-405-3173 |
Vita:
Avram Bar Cohen is Distinguished University Professor and Chair of Mechanical Engineering at the University of Maryland, where he continues his research in the thermal management of Micro/Nano systems. His interests include thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology. Bar-Cohen was a founding member and currently serves on the Advisory Board of ASME’s Nanotechnology Institute and represents ASME on the Assembly for International Heat Transfer Conferences (2002-2006). Prior to accepting his current position, he served as the Director of the Center for the Development of Technological Leadership and held the Sweatt Chair at the University of Minnesota, where he earlier served as Professor of Mechanical Engineering and Director of the Thermodynamics and Heat Transfer Division.
Avram Bar-Cohen is co-author (with A.D. Kraus) of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983) and has co-edited 13 books in this field, including the ASME Press Series Advances in Thermal Modeling of Electronic Components and Systems and the John Wiley & Sons Series in Thermal Management of Microelectronic and Electronic Systems. He has authored and co-authored some 250 Journal papers, Refereed Proceedings papers, and Chapters in books, and has delivered nearly 50 Keynote, Plenary, and Invited Lectures at major technical Conferences and Institutions. Bar-Cohen served as the ASME Vice President for Research (1998-2001) and had earlier served on ASME’s Board of Research and Technology Development, as well as the ASME Board on Professional Development, and was instrumental in reviving the HTD K-16 Committee on Heat Transfer in Electronic Components in the early 1980’s. He is currently the Editor-in-Chief of the IEEE Transactions on Components and Packaging Technologies and a member of the Board of Governors of the IEEE CPMT Society.
Avram Bar-Cohen began his professional career at the Raytheon Company in Massachusetts in 1968 and for the past 35 years has been involved in the design, analysis, and optimization of thermal systems, with emphasis on the thermal packaging of electronic equipment. He has lectured widely, published extensively in the archival heat transfer and packaging literature, and taught many Short Courses on this subject, at universities and major conferences in the US and abroad. He served as General Manager and Executive Consultant for packaging and physical modeling at Control Data Corporation, 1984-1989, held a succession of academic appointments, from Lecturer to Professor, in the Department of Mechanical Engineering at the Ben Gurion University of the Negev (Israel), 1973-1988, and was on the faculty at the Massachusetts Institute of Technology, 1977-1978, and the Naval Postgraduate School, 1982. Fifty graduate students have completed their MS and PhD degrees under his direction at the University of Minnesota, Ben Gurion University, and MIT, respectively.
Prof. Bar-Cohen received the 2001 IEEE CPT Society Outstanding Sustained Technical Contributions Award, the 2000 ASME Worcester Reed Warner Medal, “..for outstanding contributions to the literature in the area of heat transfer” and was earlier recognized with the ASME Heat Transfer Memorial Award and the ASME Curriculum Innovation Award in 1999 (with S. Bhavnani and Y. Joshi), the ASME/IEEE ITHERM Achievement Award in 1998, ASME Edwin F. Church Medal in 1994, and the THERMI Award from the IEEE/Semi-Therm Conference in 1997. He is a Fellow of ASME and of IEEE, a Distinguished Lecturer for IEEE and, in the past, for ASME, was the Founding Chairman of the ITHERM Conference in 1988, and served as the General Chairman for the first InterPack (International Intersociety Packaging Conference) in 1995.
Education:
Ph.D., Massachusetts Institute of Technology, 1971
Research Interests:
Thermal management of Micro/Nano systems, including thermal design, ebullient heat transfer, and thermal phenomena in microelectronic, photonic, and biological systems, as well as technology forecasting and management of technology.
Honors/Awards:
1983 ASME Fellow; 1992 ASME Dedicated Service Award "…for his work in Professional Development;" 1994 ASME Edwin F. Church Medal, "In recognition of contributions to engineering education, continuing education and professional development on both the national and international levels;" 1993 IEEE Fellow; 1994 ASME Electronic and Electrical Packaging Division, Outstanding Contribution Award "For outstanding contributions to application of Heat Transfer Science to Electronic Packaging;" 1994-1997 ASME Distinguished Lecturer; 1997 IEEE/Semi-Therm THERMI Significant Contributor Award "For his many contributions to the thermal management of semiconductors;" 1998 ASME/IEEE ITHERM Memorial Award "For significant contributions to the field of thermal and thermomechanical engineering for electronics packaging;" 1999 ASME Heat Transfer Memorial Award "For work contributing to a greater understanding of immersion cooling, pool boiling of dielectric fluids, and other aspects of electronics cooling;" 1999 ASME Curriculum Innovation Award, Board on Engineering Education, for "The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics," (with S. Bhavnani and Y. Joshi); 2000 ASME Worcester Reed Warner Medal, "..for outstanding contributions to the literature in the area of heat transfer, including more than 180 technical papers, and pioneering research and experimentation in electronic cooling and natural convection;" 2000 IEEE Distinguished Lecturer; 2002 IEEE CPMT Society, Outstanding Sustained Technical Contributions Award, "for contributions to thermal design, modeling, and analysis and for original research on ebullient and liquid-phase cooling".
Professional Service:
ASME Activities: Editor, Advances in Heat Transfer (2005), Member, Executive Committee, Mechanical Engineering department Heads Committee (2004-2005); Member, Assembly for International Heat Transfer Conferences (2002-2006); Member, Steering Committee, Nanotechnology Institute, 2001-2004; Vice-President for Research, Board on Research and Technology Development (1998-2001); Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002); Member, Executive Committee, Board on Research and Technology Development (1995-1998); Chair (1981-1985), Member (1986- ) K-16 Committee for Heat Transfer in Electronic Equipment; Chair, BRTD Research Committee on Packaging and Physical Design of Electronic Equipment (1988-1990); Secretary, BRTD Technical Opportunities and Planning Committee, 1989-1992; Member, ASME Board on Professional Development (1989-1995); Associate Editor, ASME Transactions Journal of Mechanical Design, 1978-1982; Associate Editor, ASME Applied Mechanics Reviews, 1985-1991 IEEE Activities: Editor-in-Chief of the IEEE/CPMT Transactions on Components and Packaging Technologies (1995-2005); Member, IEEE/CPMT Board of Governors (1995-2005); Vice-chairman of the IEEE/CHMT TC-9 Committee on Thermal Control (1990-1993); Other Activities: MEDHC Executive Committee, Keynote Lecture, "Design and Optimization of Air-Cooled Heat Sinks for Sustainable Development," NSF-sponsored Workshop on Thermal Challenges in Next Generation Electronic
Systems (THERMES 2002), January 2002, Santa Fe, New Mexico.
Recent Publications:
Kraus, A. D. and Bar-Cohen, A. 1995, Design and Analysis of Heat Sinks, John Wiley and Sons, Inc., New York, (2nd printing 1997)
Afgan, N., da Graca Carvalho, M., Bar-Cohen, A., Butterworth, D., and Roetzel, W., (editors), 1996, “New Developments in Heat Exchangers,” Gordon and Breach Publishers, Australia
Bar-Cohen, A. and Kraus, A.D., Editors, 1999, Wiley Series in Thermal Management of Microelectronic and Electronic Systems: Incropera, F.P., Liquid Cooling of Electronic Devices by Single-Phase Convection, John Wiley and Sons, Inc, New York
Bar-Cohen, A., Celata, G.P., Klausner, J., Fujita, Y., Editors, 2000, Boiling 2000: Phenomena and Emerging Applications, Vol 1 & 2, (Proceedings UEF Conference, Anchorage, Alaska, May 2000), Begell House, NY, 2000
Bhavnani, S.H, Bar-Cohen, A., and Joshi, Y., 2000, The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics, Journal of Engineering Education, pp 423-427
Momoki, S., A. Bar-Cohen, and A.E. Bergles, 2000, Estimation of Major Correlations for Frictional Pressure Drop in Gas-Liquid Two-Phase Flow in Horizontal Pipes Using Predicted Flow Regime Information, Multiphase Science and Technology, Vol 12, Nos. 3&4, pp 161-175
Cardozo, R., Durfee, W., Ardichvili, A., Adams, C., Erdman, A., Hoey, M., Iaizzo, P., Mallick, D., Bar-Cohen, A., Beachy, R., Johnson, A., 2002, Experiential Education In New Product Design and Business Development, accepted for publication, Journal of Product Innovation Management, Vol 19, pp 4-17
Yazawa, K., Solbrekken, G., and Bar-Cohen, A., 2002, Modeling and Analysis of Heat Driven Forced Convection Cooling, Thermal Science & Engineering Vol. 10, No. 5, pp 29-36, Heat Transfer Society of Japan
Bar-Cohen, A. and Iyengar, M., 2002, Design and Optimization of Air-cooled Heat Sinks for Sustainable Development, IEEE CPT Transactions, Vol 25, Number 4, pp 584-591
Arik, M. and Bar-Cohen, A., 2003, Effusivity-Based Correlation of Surface Property Effects in Pool Boiling CHF of Dielectric Liquids, International Journal of Heat and Mass Transfer, Vol 46, pp 3755-3764
Afgan, N., Carvalho, M. Prstic, S., Bar-Cohen, A., 2003, Sustainability Assessment of Aluminum Heat Sink Design, Heat Transfer Engineering, 24 (4), pp 39-48
Iyengar, M., and Bar-Cohen, A., 2003, Least-Energy Optimization of Air-Cooled Heat Sinks for Sustainable Development, IEEE CPT Transactions, Volume 26, Number1, pp 16-25
Narasimhan, S., Bar-Cohen, A., Nair, R., 2003, Thermal Compact Modeling of Parallel Plate Heat Sinks, Vol 26, Number 1, EEE CPT Transactions, pp 136-146
Narsimhan, S., Bar-Cohen, A., Nair, R., 2003, Flow and Pressure Field Characteristics in the Porous Block Compact Modeling of Parallel Plate Heat Sinks, IEEE CPT Transactions, Vol 26, No 1, pp147-157.
Bar-Cohen, A. , Iyengar, M, and Kraus, A.D., 2003, Design of Optimum Plate Fin Natural Convection Heat Sinks, ASME Transactions – Journal of Electronic Packaging, Vol 125, Number 2, pp 208-216.
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